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3rd Generation <span class="match">HYPERRAM</span> offers simplified design and double data-transfer rate for better performance in IoT devices TAICHUNG, Taiwan– 2022-04-14 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, together with Infineon Technologies, a world leader in sem...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-infineon-double-bandwidth-for-iot-applications-with-hyperram3.0.html?__locale=en

What is HyperRAM™? Before knowing HyperRAM™, one should understand HyperBus™ first. HyperBus™ technology was first unveiled by Cypress in 2014, and according to Cypress, “the HyperBus™ interface draws upon the legacy features of both parallel and serial interface memories, while enhancing system per...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/what-you-need-to-know-about-hyperram.html?__locale=en

https://www.winbond.com/hq/support/online-learning/video-item/Winbond-HYPERRAM-Best-DRAM-Choice-for-AIoT-Application

TAICHUNG, TAIWAN–2022-12-09—Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that it has been awarded the 7th China IoT Technology Innovation Award 2022 by Elecfans for its continuous pursuit of technological innovation and excellent produ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_hyperram_wins_china_iot_innovation_awards_2022.html?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-HYPERRAM.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-0023.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-CAA104_1.html&level=1

(HSINCHU, Taiwan –30 October, 2019) With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU supp...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-hyperram-can-address-new-aiot-application-needs.html?__locale=en

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-0013.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-0007.html&level=1

Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinix® Titanium Ti60 F100 FPGA with the performance, low power consumption and small size needed for embedded AI applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/efinix-selects-winbond-hyperram-to-drive-a-new-generation-of-compact-ultra-low-power-ai-and-iot-devices.html?__locale=en

Winbond <span class="match">HYPERRAM</span>™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Mobiveil’s <span class="match">HYPERRAM</span> Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based <span class="match">HYPERRAM</span> x8/x16 - 250 MHz Memory TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a le...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W958D6NW.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA00-W958D8NW.html&level=1