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Date：Date: 09 - 11 April 2024Location：Nuremberg, GermanyBooth：4A-635
Winbond Electronics Corporation is going to attend Embedded World 2024 on April 9-11 as an exhibitor and Winbond we are so excited to meet our customers in person at the show.
At Embedded World 2024 this year, we will announce several new product innovations and show some outstanding demos, which is the reason why we would like to invite you to visit us at Winbond booth 4A-635.
In the next few years, the development of AI and 5G technologies will significantly push up IoT to the next level, while edge computing on each terminal devices will create the demand for product generation conversion, automotive electronics and industrial IoT will be more flourishing.
Winbond is ready and we are everywhere in your life.
You will find 3 product lines with its highlight products at Winbond booth.
1. Specialty DRAM and Mobile DRAM
- DDR3 and HYPERRAM with STM32 series
- 4Gb LPDDR4 with Mobileye EyeQ4H for ADAS Application
- 2Gb DDR3 with NXP i.MX6 for SOM Application
- Low power and Known Good Die Serial NOR Flash for TWS
- Built-in ECC and Support XIP QSPI NOR Flash with NXP LPC553S3x
- 1.2V Serial NOR Flash for MacBook Pro 14" Late 2023
3. TrustME®
- W77Q can secure and protect the confidential and sensitive data on different applications, including OTA, IoT and POS and so one.
Visit us on Winbond booth 4A. 635 and scan your lead for giveaway!
About Winbond
Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.
Event contact
Sophia Hsu
Digital Marketing Adminstrator
TEL: 886-3-5678168 Ext.78515
E-mail: YTHsu2@winbond.com