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https://www.winbond.com/productResource-files/Winbond_Specialty_DRAM_Mobile_DRAM_Product Brief_2023Q1.pdf

Winbond has launched a range of Low Power <span class="match">DRAM</span> memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power <span class="match">DRAM</span>. Its key features are: W98 Series LPSDR S<span class="match">DRAM</span> (Single Data Rate Synchronous <span class="match">DRAM</span>) Conforms to the JEDEC standard 2...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-releases-256mb-low-power-dram-at-emex-2006.html?__locale=en

(Taipei)-- Winbond Electronics Corporation announced today that it is joining with Toshiba Corporation, Japan to co-develop 0.13 micron trench type <span class="match">DRAM</span> memory technology and 512M <span class="match">DRAM</span>s. This is the first joint <span class="match">DRAM</span> process technology development project between Winbond and Toshiba, following a seri...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00005.html?__locale=en

From these recent two year, IoT has changed from analyzing information from endpoint sensor or edge device to providing an on-time inference. This transformation, so call AIoT, can reduce the system response time and overall system power consumption. It is already applied on smart speaker, smart doo...

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00002.html?__locale=en

Tokyo, Japan and Taichung, Taiwan, November 11, – Elpida Memory, Inc. (Tokyo: 6665), Japan’s leading global supplier of Dynamic Random Access Memory (<span class="match">DRAM</span>), and Winbond Electronics Corp. today announced that they have signed a Memorandum of Understanding (MOU) for <span class="match">DRAM</span> foundry services that will see...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00061.html?__locale=en

https://www.winbond.com/hq/support/online-learning/video-item/GP-Boost-DRAM-for-AI-Applications

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

Winbond has launched a range of Low Power <span class="match">DRAM</span> memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power <span class="match">DRAM</span> will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-unveils-256mb-low-power-dram.html?__locale=en

https://www.winbond.com/productResource-files/DA05-0015A1.pdf

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

(Taipei News) Winbond Electronics Corporation today announced the signing of a Memorandum of Understanding (MOU) with Infineon Technologies AG for 0.11-micron <span class="match">DRAM</span> technology. It is the first technology agreement between the two companies. Under the terms of the MOU, Winbond will manufacture commodi...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00025.html?__locale=en

(Taipei News) Fujitsu Limited, Toshiba Corporation and Winbond Electronics Corp. today announced that Winbond will join their collaborative development program for next-generation memory devices. Begun in January 1999, the 30-plus-billion-yen project has pursued development of 0.13ľm <span class="match">DRAM</span> technology...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00004.html?__locale=en

(Taipei news) Winbond Electronics Corporation Board of Directors today approved a proposal to enter product transfer and technology licensing agreement with Qimonda AG for Graphic <span class="match">DRAM</span> business that uses Graphic Double Data Rate (GDDR) specification. The plan is to acquire Qimonda’s GDDR-related pro...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00059.html?__locale=en

(Taipei News) Winbond Electronics Corporation today announced an update on its corporate <span class="match">DRAM</span> business strategy and disclosed new construction plans for its new 12-Inch fab. Pursuant to the Company's strategic <span class="match">DRAM</span> business strategy, the Company's <span class="match">DRAM</span> partner, Toshiba Corporation Japan, is in the p...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00018.html?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-GAA107_1.html&level=1