Search

W75F Secure Flash Solution is the first secure flash memory device to gain a Common Criteria (CC) EAL 5+ certificate. W75F enables secure eXecute-in-Place (XiP) and protects confidentiality and integrity of code / data in IoT devices. Application usage case include, but not limited to integrated UIC...

https://www.winbond.com/hq/hq/product/trustme/w75f-trustme-secure-memory-element/index.html?__locale=en

CC EAL5+ certified W75F memory provides comprehensive protection for code and data New ASIL-D certification helps automotive manufacturers design systems for compliance with ISO26262 functional safety standard TAICHUNG, Taiwan – November 11, 2020 – Winbond Electronics Corporation, a leading global s...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/new-asil-d-boost-safety-and-security-credentials-on-w75f-secure-memory-element.html?__locale=en

TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio aligned with Platform Security Architecture (PSA) from Arm. As the industry’s first Common...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-trustme-secure-flash-aligned-with-arm-psa.html?__locale=en

(Taichung, TAIWAN – 26 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the TrustME® W75F Secure Flash Memory has achieved PSA Certified™ Level 2 Ready in the PSA Certified independent security assurance scheme. Now...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-trustme-secure-flash-memory-achieves-psa-certified-level-2-ready.html?__locale=en

TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Arc...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-trustme-secure-flash-implementing-the-tcg-dice-architecture.html?__locale=en

https://www.winbond.com/productResource-files/Winbond%20TrustME%20Secure%20Flash%20Product%20Brief.pdf

Munich, Germany – 13 November, 2018 -- Winbond Electronics Corporation and Tiempo Secure are announcing a complete solution for certifiable Secure Elements comprised of Tiempo Secure’s fully proven hard macro IP and Winbond’s certified secure flash. The combined solution offers cloud to IoT authenti...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-tiempo-secure-offer-the-world-first-fully-cceal5-secure-element-ip-for-iot.html?__locale=en

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/W75F40WBYIDG.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/W75F40WBYJCG.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/W75F40WBYWCG.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/W75F40WQ3JBG.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/W75F40WBYIBG.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/W75F40WBYICG.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/W75F40WBYWBG.html&level=1

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/W75F40WQ3ICG.html&level=1