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<span class="match">W75F</span> Secure Flash Solution is the first secure flash memory device to gain a Common Criteria (CC) EAL 5+ certificate. <span class="match">W75F</span> enables secure eXecute-in-Place (XiP) and protects confidentiality and integrity of code / data in IoT devices. Application usage case include, but not limited to integrated UIC...

https://www.winbond.com/hq/hq/product/trustme/w75f-trustme-secure-memory-element/index.html?__locale=en

CC EAL5+ certified <span class="match">W75F</span> memory provides comprehensive protection for code and data New ASIL-D certification helps automotive manufacturers design systems for compliance with ISO26262 functional safety standard TAICHUNG, Taiwan – November 11, 2020 – Winbond Electronics Corporation, a leading global s...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/new-asil-d-boost-safety-and-security-credentials-on-w75f-secure-memory-element.html?__locale=en

TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio aligned with Platform Security Architecture (PSA) from Arm. As the industry’s first Common...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-trustme-secure-flash-aligned-with-arm-psa.html?__locale=en

(Taichung, TAIWAN – 26 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the TrustME® <span class="match">W75F</span> Secure Flash Memory has achieved PSA Certified™ Level 2 Ready in the PSA Certified independent security assurance scheme. Now...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-trustme-secure-flash-memory-achieves-psa-certified-level-2-ready.html?__locale=en

Winbond TrustME® Secure Flash products strengthens the robustness by securing code and data storage for trusted boot and firmware updates using external secure flash. In an increasingly security conscious world, robust solutions for trusted boot and firmware updates are indispensable to IoT security...

https://www.winbond.com/hq/hq/product/trustme/index.html?__locale=en

TAICHUNG, Taiwan – October 24, 2017 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced an expansion of its TrustME® Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Arc...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-trustme-secure-flash-implementing-the-tcg-dice-architecture.html?__locale=en

https://www.winbond.com/productResource-files/Winbond%20TrustME%20Secure%20Flash%20Product%20Brief.pdf

Munich, Germany – 13 November, 2018 -- Winbond Electronics Corporation and Tiempo Secure are announcing a complete solution for certifiable Secure Elements comprised of Tiempo Secure’s fully proven hard macro IP and Winbond’s certified secure flash. The combined solution offers cloud to IoT authenti...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-and-tiempo-secure-offer-the-world-first-fully-cceal5-secure-element-ip-for-iot.html?__locale=en

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