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https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-AN0000032.html&level=2

(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of June, 2009. Revenue for the month was NT$ 1.403 billion, an increase approximately 2.49 percent when compared with NT$ 1.369 billion in the previous month. Accumulated revenue for January to June of 20...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00225.html?__locale=en

(Taipei) Winbond Electronics Corporation today announced a senior management and organization restructuring. The highlights are as follows: Ą°Assistant Vice President James Zhen-Ming Fang, formerly responsible for the successful operation of Winbond's 8-inch DRAM wafer fab, has been assigned to mana...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00006.html?__locale=en

CUBE as the Solution CUBE addresses the shortcomings of conventional memory IC and module solutions through novel approaches to increasing I/O count and raising data speed, support for Through-Silicon Via (TSV) technology as an option, and its 3D architecture that reduces thermal dissipation issues....

https://www.winbond.com/hq/hq/product/customized-memory-solution/cube/index.html?__locale=en

TAICHUNG, Taiwan– 2023-09-27– Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company’s new customized ultra-bandwidth elements (CUBE) enable memory...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0927_winbond_innovative_cube_architecture_edge_ai.html?__locale=en

For the expansion plan and the technology upgrade of the 300mm wafer fab in the Central Taiwan Science Park, Winbond Electronics Corporation today (4) announced that it has signed a NT$ 7.7 billion five-year syndicated loan agreement. The signing ceremony was hosted today by Mr. Arthur Y.C. Chiao, C...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00207.html?__locale=en

Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application Winbond Electronics Corporation (WEC) today announced the launch of its latest 32bit bandwidth 32M/64Mb SDR / DDR DRAM memory which is built on its 65nm bWL process for SiP (System in Package) application. This new product is able to pro...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launchs-32bit-sdr-ddr-kgd-for-SiP-application.html?__locale=en

https://www.winbond.com/hq/support/online-learning/video-item/Winbond-12-inch-Fab-Introduction

Medium-term target Waterconsumption per unit of product until 2023 keepsnot higher than 150 L/Layer; and total water recycling rateuntil 2023keepsnot lower than 80%. 2021 target Waterconsumption per unit of product isnot higher than 150 L/Layer; and total water recycling rate is not lower than 80%. ...

https://www.winbond.com/hq/hq/about-winbond/csr-new/green-manufacturing/water-management/index.html?__locale=en

(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of April, 2009. Revenue for the month was NT$ 1.430 billion, an increase approximately 31.32 percent when compared with NT$ 1.089 billion in the previous month. Accumulated revenue for January to April of...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00223.html?__locale=en

Contents: 1.Date of occurrence of the event:2004/04/10 2.Cause of occurrence:electric power shut down 3.Countermeasures:the N/A 4.Any other matters that need to be specified: There are waferloss around NT$ 3 million and the wafer productivity loss around half a day totally after the estimation of th...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00034.html?__locale=en

(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of August, 2008. Revenue for the month was NT$ 1.848 billion, an increase approximately 19.98 percent when compared with NT$1.541 billion in the previous month. Accumulated revenue for January to August o...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00212.html?__locale=en

June 27, 2007—Winbond Electronics Corporation and Qimonda AG today announced signing a new agreement for 75nm and 58nm DRAM trench technology transfer and production capacity collaboration, which demonstrates that Winbond continuously keeps implementing advanced production technologies to strengthen...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00049.html?__locale=en

WINBOND SHIPS ONE BILLIONTH SERIAL FLASH MEMORY, RAMPS 90NM PRODUCTION, INCREASES MARKET SHARE · First Serial Flash Supplier in Full Production at 12-inch Wafer Fabrication Facility · Expands Family of 90nm Multi I/O SpiFlash Memories from 1 to 128 Megabits Taichung, Taiwan – April 12, 2010 -- Winbo...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-ships-one-billion-serial-flash-ramps-90nm-production.html?__locale=en