(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of August, 2008. Revenue for the month was NT$ 1.848 billion, an increase approximately 19.98 percent when compared with NT$1.541 billion in the previous month. Accumulated revenue for January to August of 2008 was NT$ 16.373 billion.
Driven by efforts to shrink technology and increase own-brand products at 300mm wafer fab, revenue of August demonstrated a positive growth. In the Commodity DRAM segment, shipments ramp up and the production at 70nm technology has exceeded that of 80nm technology since August. As for Mobile RAM and Specialty DRAM, the successful qualifications brought customers’ demands and the migration to 300mm wafer fab, meanwhile, is gradually underway to reduce costs. Besides, Winbond’s new products of Serial Flash accepted by first-tier companies also contributed to the revenue of this month.
Winbond, the most professional Memory IC Company, will continue utilizing its R&D resources and advanced technology to meet customers’ demands in the future.
Winbond Electronics Corp. Monthly Business Revenue Report (Unit: NT$ 1,000)
Monthly Revenue
| Accumulated Revenue | ||
---|---|---|---|
2008 August | 1,848,300 | 2008 Jan. ~ Aug. |
16,373,015 |
2008 July |
1,540,550 |
2007 Jan. ~ Aug. | 22,425,178 |
Increase (Decrease) |
19.98 % |
Increase (Decrease) |
(26.99)% |
Note1: The 2008 revenue is internal data and has not been audited by a CPA.
Note 2: Revenue dose not include Logic IC Business from July 2008.
Spokesperson
Wilson Wen
Executive Vice President of Memory IC Manufacturing Business Group
Tel:03-5792755
News Liaison
Mike Liu
Deputy Director
Tel:0966-233360
Email:ckliu@winbond.com