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Water Management Medium-term target Waterconsumption per unit of product until 2023 keepsnot higher than 150 L/Layer; and total water recycling rateuntil 2023keepsnot lower than 80%. 2020 target Waterconsumption per unit of product isnot higher than 150 L/Layer; and total water recycling rate is not...

https://www.winbond.com/hq/hq/about-winbond/csr-new/green-manufacturing/water-management/index.html?__locale=ja

https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=ja&xmlPath=/support/resources/.content/item/DA01-AN0000032.html&level=2

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=ja

Winbond Electronics Corp., Japan will be exhibiting the Automotive related products at the 7th Automotive World 2015/ CAR-ELE JAPAN, the largest showcases in Asia’s Automotive electronics, from January 14-16 at Tokyo Big Sight, Japan. Please come to visit us! For more information about Automotive Wo...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/events/product-promotion/promotion00014.html?__locale=ja

Green Products Winbond adheres strictly to international guidelines and standards such as QC 080000 (Hazardous Substance Process Management System Requirements), RoHS Directive (EU Restriction of Hazardous Substances in Electrical and Electronic Equipment), REACH (Registration, Evaluation, Authoriza...

https://www.winbond.com/hq/hq/about-winbond/csr-new/green-manufacturing/hazardous-substance-management/index.html?__locale=ja

台湾台中市発 – 2023-06-15 – 半導体メモリソリューションの世界的大手サプライヤーであるウィンボンド・エレクトロニクス株式会社は本日、８MビットのシリアルNORフラッシュW25Q80RVを発表しました。これは、産業用および民生用アプリケーションで使用されるコネクテッドエッジデバイスの要件に対応するため、高い読み取り性能を備えた低消費電力で高性能かつ小型フォームファクタのシリアルNORフラッシュファミリの最初の製品です。 IoTデバイスは、小型かつアップグレード可能なシステムに、処理や接続、センサー技術を組み合わせた産業用ファクトリーオートメーションや、スマートホーム制御アプリケーシ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0615_winbond_next_generation_8mb_serial_flash_edge_device_constrained_iot_applications.html?__locale=ja

https://www.winbond.com/productResource-files/Winbond%20Automotive%20Flash%20Product%20Brief.pdf

https://www.winbond.com/productResource-files/Winbond%20Serial%20Flash%20Product%20Brief.pdf

(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of June, 2009. Revenue for the month was NT$ 1.403 billion, an increase approximately 2.49 percent when compared with NT$ 1.369 billion in the previous month. Accumulated revenue for January to June of 20...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00225.html?__locale=ja

For the expansion plan and the technology upgrade of the 300mm <span class="match">wafer</span> fab in the Central Taiwan Science Park, Winbond Electronics Corporation today (4) announced that it has signed a NT$ 7.7 billion five-year syndicated loan agreement. The signing ceremony was hosted today by Mr. Arthur Y.C. Chiao, C...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00207.html?__locale=ja

Contents: 1.Date of occurrence of the event:2004/04/10 2.Cause of occurrence:electric power shut down 3.Countermeasures:the N/A 4.Any other matters that need to be specified: There are <span class="match">wafer</span>loss around NT$ 3 million and the <span class="match">wafer</span> productivity loss around half a day totally after the estimation of th...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00034.html?__locale=ja

Winbond specializes in the design of high-performance, low-power memory, and riding on the strength of having a 12-inch fab, offers a whole series of Code Storage Flash Memory, Specialty DRAM and Mobile DRAM. The in house <span class="match">wafer</span> fabrication provides customers with full commitment in capacity support ...

https://www.winbond.com/hq/hq/support/online-learning/video-item/video00007.html?__locale=ja

Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application Winbond Electronics Corporation (WEC) today announced the launch of its latest 32bit bandwidth 32M/64Mb SDR / DDR DRAM memory which is built on its 65nm bWL process for SiP (System in Package) application. This new product is able to pro...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launchs-32bit-sdr-ddr-kgd-for-SiP-application.html?__locale=ja

(Taipei) Winbond Electronics Corporation today announced a senior management and organization restructuring. The highlights are as follows: Ą°Assistant Vice President James Zhen-Ming Fang, formerly responsible for the successful operation of Winbond's 8-inch DRAM <span class="match">wafer</span> fab, has been assigned to mana...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00006.html?__locale=ja

WLCSP(ウエハーレベルチップスケールパッケージ)のHyperRAM™はフォームファクタの小型化、単純化を実現 (台湾台中 – 2020年6月10日)-- 半導体メモリソリューションのリーディングサプライヤであるウィンボンド・エレクトロニクス株式会社は、組み込みアプリケーション向けでは過去に例の無い薄型フォームファクタを可能にするWLCSPパッケージをHyperRAM™に導入したことを発表しました。 HyperBus™テクノロジーは、2014年サイプレス社によって最初に発表された技術です。他のメモリのトランスミッションおよび制御インターフェースと比較して、HyperBus™はピン数が少ないこ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-leads-the-era-of-wearable-devices-with-hyperram-wlcsp.html?__locale=ja