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The Fab1, Winbond's first 5-inch fab, started operation.Fab 1 produced the first wafer.
Other
https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=uk
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AN0000032 UV Process Specification for Flash KGD Wafer
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=uk&xmlPath=/support/resources/.content/item/DA01-AN0000032.html&level=2
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Winbond Announces Monthly Revenue for June
News
(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of June, 2009. Revenue for the month was NT$ 1.403 billion, an increase approximately 2.49 percent when compared with NT$ 1.369 billion in the previous month. Accumulated revenue for January to June of 20...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00225.html?__locale=uk
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Winbond Electronics Corporation Signed a NT$ 7.7 Billion Syndicated Loan Agreement with 11 Domestic Banks
News
For the expansion plan and the technology upgrade of the 300mm <span class="match">wafer</span> fab in the Central Taiwan Science Park, Winbond Electronics Corporation today (4) announced that it has signed a NT$ 7.7 billion five-year syndicated loan agreement. The signing ceremony was hosted today by Mr. Arthur Y.C. Chiao, C...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00207.html?__locale=uk
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Winbond Automotive Flash Product Brief
Code Storage Flash MemorySerial NOR FlashQspiNAND FlashSLC NAND FlashAutomotiveProduct Brief
https://www.winbond.com/productResource-files/Winbond Automotive Flash Product Brief_EN_2024Q3_v1.pdf
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The subsequent to the electric power shut down in Science-Based Industrial Park last weekend, Winbond today issued that the impact to the company
News
Contents: 1.Date of occurrence of the event:2004/04/10 2.Cause of occurrence:electric power shut down 3.Countermeasures:the N/A 4.Any other matters that need to be specified: There are <span class="match">wafer</span>loss around NT$ 3 million and the <span class="match">wafer</span> productivity loss around half a day totally after the estimation of th...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00034.html?__locale=uk
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Winbond 12-inch Fab Introduction
https://www.winbond.com/hq/support/online-learning/video-item/Winbond-12-inch-Fab-Introduction
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Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application
News
Winbond launchs 32bit 32M/64Mb SDR/DDR KGD for SiP application Winbond Electronics Corporation (WEC) today announced the launch of its latest 32bit bandwidth 32M/64Mb SDR / DDR DRAM memory which is built on its 65nm bWL process for SiP (System in Package) application. This new product is able to pro...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-launchs-32bit-sdr-ddr-kgd-for-SiP-application.html?__locale=uk
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Water Management
Other
Medium-term target Waterconsumption per unit of product until 2023 keepsnot higher than 150 L/Layer; and total water recycling rateuntil 2023keepsnot lower than 80%. 2021 target Waterconsumption per unit of product isnot higher than 150 L/Layer; and total water recycling rate is not lower than 80%. ...
https://www.winbond.com/hq/hq/about-winbond/csr-new/green-manufacturing/water-management/index.html?__locale=uk
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Winbond Announces Corporate Reorganization Winbond Announces Corporate Reorganization
News
(Taipei) Winbond Electronics Corporation today announced a senior management and organization restructuring. The highlights are as follows: Ą°Assistant Vice President James Zhen-Ming Fang, formerly responsible for the successful operation of Winbond's 8-inch DRAM <span class="match">wafer</span> fab, has been assigned to mana...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00006.html?__locale=uk
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Winbond leads the era of wearable devices with the launch of HyperRAM™ WLCSP package
News
HyperRAMTM devices with Wafer Level Chip Scale Package (WLCSP) help make form factor smaller and simpler (Taichung, Taiwan – June 10, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new HyperRAM™ products with...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-leads-the-era-of-wearable-devices-with-hyperram-wlcsp.html?__locale=uk
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Winbond Serial Flash Product Brief
Code Storage Flash MemorySerial NOR FlashProduct Brief
https://www.winbond.com/productResource-files/Winbond Serial NOR Flash Product Brief_EN_2024Q3_v1.pdf
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Winbond Introduces Products for Broad Range Applications: 256Mb, 512Mb, 1Gb DDR2 SDRAM
News
Introducing products for broad range applications: 256Mb, 512Mb, 1Gb DDR2 SDRAM Winbond has introduced a family of DDR2 SDRAM products based on advanced DRAM technology, including 256Mb (W9725G6IB series), 512Mb (W9751G6IB series) and 1Gb (W971GG6IB series). These products are all in compliance with...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-256mb-512mb-1gb-ddr2-sdram.html?__locale=uk
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Winbond Announces Monthly Revenue for April
News
(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of April, 2009. Revenue for the month was NT$ 1.430 billion, an increase approximately 31.32 percent when compared with NT$ 1.089 billion in the previous month. Accumulated revenue for January to April of...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00223.html?__locale=uk
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Earthquake Report
News
(Taipei News) Subsequent to an earthquake of 6.7 magnitude that struck Taiwan at 2:23 a.m. on June 11 2000, Winbond Electronics Corporation today issued the following report on the status of Company facilities. After 20 hours of thorough facilities inspection and exhaustive safety reviews, the Compa...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00007.html?__locale=uk
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