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Winbond Announces 512M bit mobile LPDDR & LPSDRAM for mobile display & mobile data communication application

Winbond Announces 512M bit mobile LPDDR & LPSDRAM for mobile display & mobile data communication application



    Winbond Announces New 512Mbit mobile LPSDRAM

    Mar/31/2011

    512M mobile LPSDRAM

    W989D6C, W989D2C, Mobile LPSDR: 166MHz, respectively, supporting x16/x32 data widths

    W949D6C, W949D2C, Mobile LPDDR: 200MHz, respectively, supporting x16/x32 data widths

 

(Hsinchu, Taiwan – Mar 31, 2011) Winbond Electronics Corporation, a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics products markets, today introduced the latest offering of its mobile LPSDRAM products. With 65nm Buried World Line technology, Winbond developed 4 devices of 512Mb mobile LPSDRAM, which helps Winbond to extend mobile LPSDRAM memory applications beyond the mobile phone field to areas of mobile consumer electronics and mobile communication.

 

The W989D6C and W989D2C are 512Mb mobile LPSDR devices which support x16/x32 data width. Major features include the following: Sequential or Interleave burst、166MHz Clock rate、Standard Self Refresh、Partial-Array Self Refresh (PASR)、Automatic Temperature Compensated Self Refresh Rate(ATCSR)、Deep Power-Down (DPD)、Programmable output buffer driver strength. They are ideal for portable multimedia players, eBook Readers, automotive applications, consumer electronics, gaming devices, and mobile devices.

 

The W949D6C and W949D2C are 512Mb mobile LPDDR devices which support x16/x32 data width. Major features include the following: Double Data Rate, Sequential or Interleave burst、200MHz Clock rate、Standard Self Refresh Mode、Partial-Array Self Refresh (PASR)、Automatic Temperature Compensated Self Refresh Rate(ATCSR)、Deep Power-Down (DPD)、Programmable output buffer driver strength. They are ideal for portable multimedia players、eBook Readers、mobile phone、mobile data modem、automotive applications, consumer electronics, gaming devices, and mobile devices.

 

Winbond will further develop 46nm technology to be used for next generation mobile LPDRAM products.

 

Availability and Pricing:

 

All samples will be available in March 2011; production will be in April 2011:

    W989D6C x16 data widths mobile LPSDR 54-ball VFBGA, 8mmx9mmx1.0mm

    W989D2C x32 data widths mobile LPSDR 90-ball VFBGA, 8mmx13mmx1.0mm

    W949D6C x16 data widths mobile LPDDR 60-ball VFBGA, 8mmx9mmx1.0mm

    W949D2C x32 data widths mobile LPDDR 90-ball VFBGA, 8mmx13mmx1.0mm

 

For specific lead-time, pricing and additional information, please contact your local Winbond representative or distributor.

 



About Winbond


Winbond Electronics Corporation is the Memory IC Company with professional capacity in product design, manufacturing, and sales services. By continuous innovation in technology, the Company strives to provide and develop customer-driven memory solutions.

 

As the first-rate semiconductor company, Winbond exploits its advanced design skills and production technologies to continually boost the competitive advantages of its dedicated brand-name products. Winbond’s three business groups each focus on specific fields. Of which, DRAM Product Business Group specializes in Mobile RAM and Specialty DRAM products which are designed to meet the demands of niche memory market for high-speed memory with low-power consumption. Flash Memory IC Business Group offers low/medium density NOR Flash products, including parallel Flash and serial Flash for the computer, consumer and communication markets. Based on a 300 mm wafer fab, Memory IC Manufacturing Business Group keeps pace with the latest technologies to provide high-quality memory IC manufacturing services. Now the 300 mm wafer fab is running at a monthly capacity of 37,000 wafers and production technologies covers from 90nm to 65nm.

 

Winbond headquarters in Central Taiwan Science Park, Taiwan, and also has subsidies in America, Japan, and Hong Kong. For more information, please visit: http://www.winbond.com.


Note: Winbond is registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners

 

 


Product Contact:


Ann Hsu

Deputy Director

Mobile RAM Marketing Division

TEL: 886-3-5678168# 85389

Email: hhhsu1@winbond.com

 

News Contact:


Jenny Chen

Sales Promotion Department

TEL: +886-3-5678168# 86333

Email: WCChen22@winbond.com

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