• Date
  • Date 2023/09
    Milestones Winbond introduces innovative CUBE architecture for powerful edge AI devices
  • Date 2023/08
    Milestones Mass production of DRAM product with self-developed 20nm process technology.
  • Date 2023/07
    Milestones Successful verification of NOR Flash product with self-developed 45nm process technology.
  • Date 2023/03
    Milestones Winbond Group Recognized as a “Top 100 Global Innovator 2023”.
  • Date 2022/12
    Milestones Kaohsiung Fab has passed the verification for quality system and international standards for environment, safety, and health. The first batch of self-developed 25Snm DRAM products, with the first 4G DDR3 product shipped in September, achieved qualification and entered into mass production in December.
  • Date 2022/11
    Milestones Winbond won “Corporation Comprehensive Performance - Top 100 Taiwanese Companies Sustainability Awards”, “Corporate Sustainability Report - IT & IC Manufacturing Platinum Award”, and “Best Sustainability Practice Awards - Talent Development Leadership Award” in the Taiwan Corporate Sustainability Awards (TCSA) 2022.
  • Date 2021/12
    Milestones Kaohsiung Fab received Building Use Permit and Fab Certificate.
  • Date 2021/11
    Milestones Received “Corporate Sustainability Report Golden Award” , “Top 50 Taiwanese Companies Sustainability Awards” , “ Talent Development Leadership Award “ and ” Growth Through Innovation Leadership Award” from Taiwan Institute for Sustainable Energy (TAISE)
  • Date 2021/11
    Milestones HyperRAM won Memory IC Awards of 2021 EE Awards Asia
  • Date 2021/07
    Milestones TrustME® W77Q won “2021 Science Park Innovative Product Award “
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