Milestones - Winbond

Date

Milestones
Date 2025/12

Milestones Winbond Kaohsiung Fab received 2025 MOEA Energy Conservation Benchmark Gold Award and Silver Award at the 7th National Enterprise Environmental Protection Award
Date 2025/10

Milestones The first Taiwanese semiconductor company to receive full funding from the MOEA Industrial Development Administration’s “Large leads small” program, partnering with 13 suppliers to achieve 19,995 tons of CO2e reduction—240% above target
Date 2025/09

Milestones Successful verification of DRAM product with self-developed 16nm process technology
Date 2025/01

Milestones Mass production of NAND Flash product with self-developed 24nm process technology
Date 2024/12

Milestones WEC Carbon Accounting Platform Go Live (Carbon Inventory + Carbon Footprint)
Date 2024/12

Milestones Awarded the 2024 National Sustainable Development Award, the TCSA Taiwan Top 100 Sustainable Companies Award, and six individual performance awards
Date 2024/10

Milestones Achieved TIPS (Taiwan Intellectual Property Management System) A-level certification for the second consecutive year
Date 2024/10

Milestones Awarded the Department of Industrial Technology, MOEA's IC Design Subsidy Program for the 3D CUBE Innovative Service Application Platform Project
Date 2023/09

Milestones Winbond introduces innovative CUBE architecture for powerful edge AI devices
Date 2023/08

Milestones Mass production of DRAM product with self-developed 20nm process technology