Winbond Electronics Corporation (“Winbond”) was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park (CTSP), Taichung, Taiwan and operates two 12-inch highly intelligent and automated fabs located in CTSP and South Taiwan Science Park (STSP)’s Kaohsiung Science Park.
Winbond stands out as one of the few companies worldwide with proprietary products and technology in both memory and logic integrated circuits. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total integrated circuits solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash, Customized Memory Solution (CMS), and various Logic IC solutions.
Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics.
Winbond has set up operations and distributor networks in the USA, China, Japan, Germany, India, Korea, Hong Kong, Singapore and Israel to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety.
Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top listed companies in corporate governance.
Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.