Winbond Electronics Corporation Announces Successful Establishment of B2B Process Integration Scheme

[Taipei News] Winbond Electronics Corporation, the largest brand name IC manufacturer in Taiwan, today announced that it has successfully established a business-to-business (B2B) process integration scheme via RosettaNet’s Partner Interface Process(PIP)3D8, Distribute Work-In-Process (WIP). This milestone makes Winbond the first brand name IC manufacturer in Taiwan to introduce the RosettaNet supply chain standard. As a founding member of RosettaNet's global Semiconductor Manufacturing Board (SM Board), Winbond is actively involved in setting and promoting the B2B international WIP standard. In addition to achieving this process integration with manufacturing partners such as Advanced Semiconductor Engineering Inc. (ASE), Winbond also plans to implement RosettaNet business process standards with domestic and overseas customers and suppliers to improve overall supply chain efficiency.

"Winbond's goal in establishing B2B and in using the RosettaNet platform is to simplify and integrate its complex supply chain process,"noted Dr. George Tsao, Assistant Vice President, Winbond's Knowledge Management Center. "Streamlining this multi-tiered effort will further Winbond's goal to become the most advanced knowledge management semiconductor supplier in Taiwan. The implementation of such an evolved process integration system will greatly enhance business efficiencies by establishing complete up-stream and down-stream supply chains."

Winbond is currently using RosettaNet 3D8 with the leading IC packaging/testing company ASE. In addition, Winbond will work with TSMC to introduce additional PIPs, including 3A4, 3A7 (Order Management) in the third quarter and some of the 3B series PIPs (Transportation & Distribution) in the fourth quarter of this year. The Company's goal is to gradually complete semiconductor supply chain integration with all up stream contract suppliers and down stream channel customers. The strategy will enable Winbond to reduce time to market, reduce supply chain inventory cost and increase customer satisfaction. Using a fully integrated supply chain management system will enable Winbond's customers to instantly access information for ordered IC products--from processing to packaging--via RosetaNet's high visibility supply chain platform. By introducing the RosettaNet standard, Winbond will increase supply chain management efficiency and in turn, its overall competitiveness in the global semiconductor market.

About RosettaNet

RosettaNet is an independent, non-profit consortium dedicated to the collaborative development and rapid deployment of open Internet-based business standards that align processes within the global high-technology trading network. 

More than 400 companies representing over $1 trillion in annual information technology, electronic components and semiconductor manufacturing revenues currently participate in RosettaNet's standards development, strategy and implementation activities. An complete list of member companies and more information on RosettaNet is available at 


About Winbond Electronics Corporation

Winbond Electronics Corporation was founded in 1987 and is based in Hsinchu Science-Based Park, Taiwan. It has since become the largest branded IC company in Taiwan, offering a broad range of PC and peripheral-related ICs, consumer electronics ICs, multimedia ICs, and memory ICs. Winbond is a market leader in the telephone dialer, PC I/O controller, memory, speech synthesizer and MPEG decoder markets. With four wafer fabs currently in operation, the Company utilizes process technologies ranging from 1.0 micron down to 0.175 micron. Winbond has more than 4,500 employees worldwide with design centers located in Hsinchu, Taiwan; Shanghai, China; San Jose, California; Austin, Texas; and Herzliya, Israel. 

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