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Winbond Electronics Corporation Announces Executive Organizational Changes

(Taipei News) The board directors of Winbond Electronics Corp. passed an important resolution on management change today. Wilson Wen is appointed the Vice President. Mr. Wen will be the head of Administrative Center and be responsible for human resources, procurement, public affairs and public relations. Mr. Hander Chang, its current Assistant Vice President of Administrative Center, has been promoted to the position of President, Winbond Electronics (Shanghai) Ltd.. Mr. Chang will be responsible for customer support and services in Mainland China. The previous President, Mr. Tony Huang, will take on a new assignment back at Winbond's headquarters, continuing to assist corporate sales and marketing. Finally, the Company announced that it has promoted Dr. Hong-Hsiang Tai to the position of Assistant Vice President of The Company's Memory Technology Center. 

According to Winbond, the afore listed promotions and organizational changes have been implemented as part of the Company's long-term strategy to establish itself as a global player in the semiconductor market and to further develop it's executive management experience and expertise. The Company maintains a corporate culture and policy of promoting from within in order to enhance core skill sets and leverage existing experience and talent. 

Prior to serving as Hannstar Display Corporation's CEO, Mr. Wen worked for Winbond. Among his job assignments were Manager of Manufacturing Department, Deputy Director and Director for Testing Division and Director of Fabrication Division. He also served as a AVP of Manufacturing Center in Winbond. Mr. Wen's background with Winbond, its corporate culture and inner workings, makes him uniquely qualified for the position of Vice President, Administration Center. In the future, he will be tasked with developing processes and procedures to enhance the Company's administrative functions and services.

Mr. Chang, one of the founder of Winbond Electronics Corporation, has been promoted to his new position as President, Winbond Electronics (Shanghai) Ltd.. Prior to Mr. Chang serving as Winbond's AVP, Administration Center, he was Director of Administration Center and also has served in the capacity of Winbond's AVP for its Facility and Service Center. Mr. Chang was also the Standing Director of the Association of Allied Industries in Science-based Industrial Park. In that capacity he served as a liaison for the park's community of high tech companies, working with government officials and other public and regulatory agencies. 

Mr. Tony Huang served for two years as Winbond's President, Winbond Electronics (Shanghai) Ltd.. During that time, he established solid relationships with customers, building the comapny into a first class customer service provider for Winbond products by building the crucial infrastructure necessary to establish a regional, growing business. In the future, Winbond will utilize Mr. Huang's experience and expertise to assist in achieving WinbondĄŚs marketing objectives.

Dr. Tsai has a Ph.D. in Electrical Engineering from Taiwan's National Chiao Tung University. He has more than 20 years experience in process research and development. Prior to joining Winbond, Dr. Tsai worked with Vanguard International Semiconductor Corporation and Electronics Research & Service Organization (ERSO) of Industrial Technology Research Institute.

In concert with Winbond's operational strategy focus established in 2002, the Company is continuing to move forward by developing its leadership and management expertise enabling the Company to move forward with its goal of becoming a global semiconductor provider.




Spokesperson
    Wilson Wen
    Vice President of Administrative Center
    Tel:03-5792755
 
News Liaison
    Mike Liu
    Deputy Director
    Tel:03-5792516
    Email:ckliu@winbond.com


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