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Winbond Electronics Corporation and Infineon Technology AG Announce New Agreement for Technology Transfer

(Taipei News) Winbond Electronics Corporation and Infineon Technology AG officially signed an agreement to transfer the 0.09-micron DRAM process technology and 12-inch fab production technology on August 6, 2004. 

Winbond showed that the focus of Winbond's DRAM business group is to provide a portable products as a total solution to customers. The 0.09-micron DRAM process technology transferred by Infineon will be employed to develop low power SDRAMs, Pseudo SRAMs and other related memory products in the future. The 0.09-micron process technology will play a crucial role when production at the 12-inch fab enters the mass production stage. According to this cooperation agreement, Winbond will acquire assistances of newly built 12-inch fab planning as well as mass production. 

In the field of production capacity, Winbond will reserve a portion of the production capacity for Infineon. Looking forward, the two companies will share the profits so the mutually beneficial relationship of technology and capacity-sharing is a win-win situation for both sides.

Winbond's previous successful collaboration with Infineon in the 0.11-micron process technology transfer has paved the way for the recent 0.09-micron process technology transfer and production capacity cooperation agreement. This further solidifies the foundation for future high-level technology transfer cooperations between the two companies.



 


Spokesperson
    Wilson Wen
    Vice President of Administrative Center
    Tel:03-5792755

News Liaison
    Mike Liu
    Deputy Director
    Tel:03-5792516
    Email:ckliu@winbond.com


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