Winbond Electronics Corporation Announces Sales Executive Management Change

Winbond today announced that the Board of Directors has passed a resolution regarding the major executive management change. To further pursue his personal career goals, Mr. Tung-Yi Chan, Vice President of Sales Center, decided to resign the position effective on October 1st, 2005. The position will be filled by Mr. Pei-Ming Cheng, current Assistant Vice President of Product Center, Logic IC Business Group, who will be promoted as Vice President.

Mr. Pei-Ming Cheng was graduated from National Cheng-Kung University with a bachelor degree and joined Winbond after receiving a master degree in Electrical Engineering from University of Detroit. Mr. Cheng's experience with Winbond includes serving as Assistant Vice President in the Product Center, working in the International Business Department, Computer Product Marketing Division and so on. Mr. Cheng possesses a full-blown experience in different dimension of sales, market planning and product management. With his expertise in product marketing and product management, he has led his team showing outstanding performance in the PC and Peripherals products.

Winbond has laid a solid foundation for its sales business in the recent years. With the new leadership in the sales force, and the 12" Fab's entering mass-production stage soon, Winbond will continuously strive to expand its customer bases and product applications and provide better quality and efficiency of services to the customers in the future.


    Wilson Wen
    Vice President of Administrative Center

News Liaison
    Mike Liu
    Deputy Director

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