Winbond Electronics held the grand opening ceremony for its 12 -inch fabrication plant at Central Taiwan Science Park

(Taipei News) Winbond Electronics Corporation held its grand opening ceremony for the new 12-inch fab at Central Taiwan Science Park on April 20. Guests in presence to witness this historical event included Hung-Duen Yang, Deputy Minister of the National Science Council, Wen-Ke Yang, Deputy General Director of the Central Taiwan Science Park Provisional Office, Chung-Sheng Huang, Magistrate of Taichung County, Jia-Qi Hsiao, Deputy Mayor of Taichung City, customers and suppliers.

The grand opening ceremony of Winbond 12-inch fabrication plant declares that Winbond has officially entered the era of 12-inch volume production. The investment of NT$ 49 billion began with the groundbreaking in July, 2004, placing the upper-beam in December 2004, a pilot run in September 2005 and entering the mass production stage in the second quarter of 2006. The 12-inch fabrication plant consists of Fab A and Fab B. The current capacity of Fab A is 8,000 pieces of wafers per month and is expected to reach 24,000 pieces of wafer per month by the end of 2006. The estimated capacity of Fab B is also 24,000 pieces of wafers per month and expects to start its operation after Fab A reaches its maximum capacity. 

After the 12-inch fab begins its operation, Winbond is able to use more advanced process technology to meet the demands of product development. The 0.11- micron process technology has been implemented, followed by the 0.09 - micron to promote a better process ability. The major products to be manufactured in the 12-inch fab are Specialty DRAM, Pseudo SRAM, and part of its capacity will be used for DDR2. Winbond will be able to reap the benefits from the synergy achieved amongst the different product lines and hence provide comprehensive services to customers.

Following the launching operation of its 12-inch fab, Winbond currently has four fabs in total. The 6-inch fab mainly produces wafers for logic products such as Consumer ICs, PC & Peripheral product ICs and Network Access related ICs of which manufacturing capacity is around 50,000 pieces of wafers per month. The two 8-inch fabs mainly produce memory products including Specialty DRAM, Pseudo SRAM and Flash, and its manufacturing capacity is around 40,000 pieces of wafers per month.

The new 12-inch plant plays a crucial role for Winbond in enhancing its long- term competitive ability for the future. The kicking-off operation of the 12- inch fab has not only been longing expectation of Winbond, but also a focus of high-technology industry in Taiwan. In the future, Winbond will continue to stick to its own brand name strategy and maximize the value of IDM (Integrated Device Manufacturer).

    Wilson Wen
    Vice President of Administrative Center

News Liaison
    Mike Liu
    Deputy Director

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