Winbond Board Resolved the Carve-Out of its Logic IC Business The New Company is dubbed Nuvoton Technology Corporation

(Taipei News) Winbond Electronics Corporation today announced that its Logic IC business spin-off, dubbed Nuvoton Technology Corporation, will be a wholly owned subsidiary of Winbond, according to the resolution approved by the Board of Directors in the meeting held on March 14, 2008. Winbond, meanwhile, will remain to focus on designing and producing Memory products. This proposal will be executed while approved in the shareholders’ meeting on April 30, 2008.

Winbond will significantly strengthen its positive position through the strategic carve-out. The company has started the realignment, adjusting Logic and Memory business groups to five profit centers, to reinforce its operating efficiency since the first of October last year. Due to the different models of business characteristics, today the Board further resolved to separate the Logic and Memory business groups. Given the specialization and division of the labor, Winbond and Nuvoton will continue moving forward with maximum competitiveness respectively.

With the spin-off, Nuvoton will succeed on the product lines, intellectual properties, cooperation partners and customers of the Logic Business. Based on the solid foundation, Nuvoton will be at a full speed to reinforce product innovation and acquaintance in the end market to provide customers with much more perfect service. Winbond, meanwhile, will concentrate on the memory business including DRAM product, Flash memory IC, and memory IC manufacturing, and also keep delivering high-quality as well as high-yield products to meet the market demand.

Winbond will acquire all the issued shares of Nuvoton at a net price of NT$10.9 per share. Nuvoton’s capital stock will be NT$ 2.5 billion. After both Winbond and Nuvoton shareholders approve this spin-off, the record date will be jointly decided by the Board meetings of Winbond and Nuvoton. Tentatively the record date is set on July 1st, 2008.


    Wilson Wen
    Vice President of Administrative Center

News Liaison
    Mike Liu
    Deputy Director

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