Winbond Electronics Corporation Announces Monthly Revenue Results for December, 2002

(Taipei News) Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today announced revenue results for the month of December 2002. Revenue for the month was approximately NT $2.536 billion, an increase of 24.43 percent, when compared with NT $2.038 billion over the same period last year. Accumulated revenue for January to December 2002 was NT $32.089 billion, an increase of nearly 34.34 percent, when compared with NT $23.887 billion over the same period last year. 

Due to the seasonal decrease in demand typical of this time of the year, revenue for December 2002 was down slightly from November 2002. However, results reflected an increase of 24.43 percent over the same period last year. Looking forward to 2003, the Company continues to focus on improving its operational strategy, an effort that has gradually been yielding results. A number of highly competitive products, aimed at growing markets, are expected to be launched in 2003. In addition, Winbond recently launched a digital still camera chip that integrates digital imaging logic IC, flash and SDRAM into one package. By integrating all these technologies into one package, this product constitutes one of the Company's first System in a Package (SIP) products. The chip is compatible with both built-in and embedded interfaces and it currently being used in an application featuring a digital camera integrated into a cellular phone. The product has been designed-in and successfully qualified by customers; mass production is expected in March 2003. 

Furthermore, Winbond continued to hold its position as a market leader in DDR memory products. Because the de facto standard for DDR has migrated from 266MB to 400MB, Winbond is now one of the few suppliers worldwide to manufacture this technology. This enables the Company to take advantage of the growing DDR market and continue to gain market share. In addition, the Company's low power SDRAM continues to exhibit excellent growth potential for 2003. Currently, Winbond is working closely with a major cellular phone company to integrate its low power SDRAM solution into that Company's new cellular phone and PDA application. The chip has already been starting the pilot run successfully. The customer expects to mass-produce its new product in the second quarter of 2003.

Note : The results reported herein represent internally generated financial information that has not yet been audited by an independent, third party CPA. 

 
Spokesperson
    Wilson Wen
    Vice President of Administrative Center
    Tel：03-5792755

News Liaison
    Mike Liu
    Deputy Director
    Tel：03-5792516
    Email：ckliu@winbond.com