Winbond Announces Monthly Revenue for July

(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of July, 2008. Revenue for the month was NT$ 1.541 billion. Due to Logic IC business spin-off to Nuvoton Technology on July 1, revenue declined approximately 27.05 percent when compared with NT$2.112 billion in the previous month. Accumulated revenue for January to July of 2008 was NT$ 14.525 billion.

Revenue increased 1.29% mom while deducted Logic IC business from revenue in June. Driven by 70nm process technology introduced to the 300mm wafer fab smoothly, shipments of Commodity DRAM grew in this month. Besides, seasonal effect as well as technology migration also contributed to the revenue of Serial Flash.

Looking forward to the third quarter, the Company will gradually move forward to migrate technology and increase its branded products production. Further, the Buried Wordline technology on 65nm will be introduced in the fourth quarter to shrink DRAM production costs. 
                                                   Winbond Electronics Corp. Monthly Business Revenue Report (Unit: NT$ 1,000) 

Monthly Revenue
Accumulated Revenue
   2008 July


 2008 Jan. ~ July


   2008 June


 2007 Jan. ~ July  19,625,692
Increase (Decrease)


Increase (Decrease)


Note1: The 2008 revenue is internal data and has not been audited by a CPA.
Note 2: Revenue dose not include Logic IC Business from July 2008.

    Wilson Wen
    Executive Vice President of Memory IC Manufacturing Business Group 

News Liaison
    Mike Liu
    Deputy Director

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