Winbond Announces the Financial Results for the First Quarter of 2010

Taichung, Taiwan, April 27, 2010- Winbond Electronics Corporation today announced the results of audited financial statements for the first quarter of 2010. Net sales totaled NT$7.013 billion, up 8% QoQ and 124% YoY. Net income totaled NT$384 million. Net income per share was NT$0.11. Gross margin was 17%.

To break down revenue by business, Specialty Memory including NOR Flash、Specialty DRAM, Mobile RAM and Graphics DRAM accounted for 90% of 1Q10 revenue, a fast increase compared to the figure of the previous quarter; whereas the Commodity DRAM dropped to 10% of 1Q10 revenue. Winbond continuously made steady efforts to expand market for Specialty Memory.

In terms of product segments, NOR Flash and Mobile RAM showed notable revenue growth. Revenue from NOR Flash rose 30% QoQ and 149% YoY as gained increased market share in HDD, LCD TV, PC and PC peripherals. A historical milestone that accumulated shipping volume of Serial Flash reached 1 billion units was also achieved as of the first quarter in 2010.

As to Mobile RAM segment, revenue increased 15% QoQ and 102% YoY thanks to strong demand in mobile phone market. Specialty DRAM preformed in line with expectation. Graphics DRAM commenced shipment and formally established business with all major PC customers.

As a global major supplier of Specialty Memory, Winbond is well-positioned to take advantage of an improving demand environment and maximize its profitability by technology migration and optimum product mix. Looking to the second quarter, the Company will continue engaging in enhancing customer relations and strengthening ability to provide the best solutions to expand NOR Flash business. Moreover, as the strong demand in HDD, LCD TV and consumer electronics markets will be expected, the Company will accelerate output of 65nm Specialty DRAM to meet market demand. GDDR3 and GDDR5 will also kick off mass production in the second quarter. As a whole, Winbond holds a positive perspective on 2Q10 business.


    Wilson Wen
    Executive Vice President of Memory IC Manufacturing Business Group 

News Liaison
    Mike Liu
    Deputy Director

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