Winbond 2007 IIC-China
Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well as new products will be on display at the Shenzhen Convention and Exhibition Center (March 5 th and 6 th) and Shanghai Mart Expo (March 13 th and 14 th). Our complete product line including Mobile RAM, Computer Logic IC, Flash Memory, and μ C & μC Based Consumer IC etc. will all be on display. Details of products on display as follows:
Mobile RAM For Mobile Phones
- SDRAM : 64Mb(W9864 Series) , 128Mb(W9812 Series) and 256Mb(W9825 Series)
- Largest Capacity Pseudo SRAM on the Market
- 256MB LowPower DRAM
Computer Logic IC & Flash Memory For Information Electronics
- New ICs and Solutions for New Generation PC Platforms
- Industry's First Mobile Embedded Controllers with SPI ™ Flash Interface and Media Center Compliant Consumer IR Port
- Sideshow Embedded Controller
- New Flash Memory Products-16Mb/32Mb SPI & 16Mb/32Mb/64Mb Parallel
μC and μC Based Consumer IC For Consumer and Automobile Electronics
- 8-bit (8051 Core) LPC Series And the 32-bit (ARM Core) Microcontroller with Reference Applications
- New Music IC - W567Cxxx Series
- Home Appliances W541C480/W541E480 Microcontroller Series
- W93562 DECT/WDCT Digital Wireless Communication Chip
- New USB Audio Controller IC Series
- ISD1700 Voice&Speech ICs (ChipCorder®)
- Single Programmable Extended CODEC/SLIC IC for the VoIP Market
About Winbond
Winbond Electronics Corporation, a world-class leading supplier of IC product solutions, was founded in Hsinchu Science Park, Taiwan in 1987. The Company has excellent capacity in product design, research and development, manufacturing, marketing and sales services.
Winbond owns two business groups:
- Logic IC Business Group ------ focuses on two specific sectors including μ c-based consumer ICs and computer logic ICs.
- Memory IC Business Group -- is dedicated in Mobile RAM and Flash M emory. It covers major products in the field of low power DRAM, Specialty DRAM, Pseudo SRAM, Commodity DRAM, and low-density Flash Memory etc.
Winbond operates one 300mm wafer fab, two 200mm wafer fabs and one 150mm wafer fab. The company currently employs over 5,000 people and holds more than 2,500 patents worldwide. Winbond also has subsidiaries located in Mainland China, America, Japan and Israel.
More information about 2007 IIC-China, visit: http://www.china.iicexpo.com /
Event Contact:
Erin Chou
Sales Promotion Dept.
TEL: +886-3-5678168 ext:8686
Email: chchou7@winbond.com