Winbond introduces fully compatible drop-in replacement for SPI Flash memory offering comprehensive, end-to-end security for IoT devices

New W77Q Secure Flash memory is a drop-in replacement for existing Flash devices, supporting secure boot, root-of-trust and resilience, and providing strong protection for operations such as over-the-air updates and device authentication


(Taichung, TAIWAN – 25 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today extended its innovative family of certified TrustME ® Secure Flash memory chips by introducing the W77Q series for IoT and smart connected consumer and industrial devices.

The new W77Q provides hardware root-of-trust and secure, encrypted data-storage and data-transfer capabilities. By ensuring robust, end-to-end security in IoT devices it enables:

The W77Q series products are supplied in industry-standard packages and pin-outs, and feature a standard single/dual/quad/QPI serial peripheral interface (SPI). This means that they can be used as a simple drop-in replacement for non-secure SPI NOR Flash devices.


Independent security certification

The W77Q and W75F are designed to cover the whole range of assurance levels mandated by the European Cybersecurity Act and other regulations. The W77Q is intended for use in consumer and industrial devices which need the security functions required for compliance with the Substantial and Basic assurance levels specified in the Act. The W77Q supports conformance to the Common Criteria EAL2, SESIP and Arm® Platform Security Architecture (PSA) security specifications.

The W75F is certified for Common Criteria EAL5+, which means it is suitable for use in payment and communications devices, and in applications requiring the High assurance levels specified in the Cybersecurity Act.

Hung-Wei Chen, Marketing Director for the Secure Flash product line at Winbond, said: ‘The W77Q is a game-changer product, a follow-on to the existing W75F which offers the industry's strongest security in an SPI Flash memory, suitable for the most sensitive financial and communications applications. Now, with the W77Q, Winbond is meeting the need of customers to protect and authenticate any kind of smart, connected device used at home or in the factory.


Comprehensive security functionality

The W77Q offers the secure storage and data-transfer capabilities needed to protect IoT devices and user data. Its main security features include:

The W77Q also provides the high speed, long data retention and strong data integrity of Winbond’s standard SPI Flash memory ICs. Its specifications include:

The W75F will be demonstrated in an Arm PSA security application running on the Arm TF-M operating system.

The first W77Q part, in a density of 32Mb, is available for sampling now. The W75F is available in production volumes. More information may be found at www.winbond.com.

About Winbond
Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond’s headquarters is in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong.

Based in Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.


TrustME ® is a trademark of Winbond Electronics Corporation.  All other product names that appear in this material are for identification purposes only and are acknowledged trademarks or registered trademarks of their respective companies.

Product Contact
Hung-Wei Chen
Security Flash Product Line Director
TEL: +886-3-5678168 #71469
E-mail: HWChen8@winbond.com

News Contact
Yulia Lee
Digital Marketing Manager
TEL: +886-3-5678168 #75395
E-mail: YLLi5@winbond.com

Jessica Chiou-Jii Huang
Vice President & Chief Financial Officer
TEL: +886-3-5678168/886-987-365682


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