Winbond to reveal a new-generation Ultra-Low-Power Mobile DRAM solution at the 2018 electronica conference

MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-low-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-low power and high performance of this product make it particularly suitable for wearable and portable devices, or comparable internet-of-things applications.

The W948V6KBHX is the first product released by Winbond that carries the latest deep self refresh (DSR) technology. It has a capacity of 256 Mb and is compatible with the LPDDR standards of JEDEC. Compared with the memory of conventional mobile devices, DSR technology decreases standby power consumption by 40%, greatly extending battery life and enhancing end-user experience.

Battery-powered wearable and portable devices are commonly used in daily life. Among such devices, imaging equipment, such as monitoring systems, require memory exceeding the capacity of embedded SRAMs. The W948V6KBHX, which achieves a balance between high performance and low power consumption, has potential to be the optimal DRAM solution for wearable or portable imaging devices.

The excellent performance of W948V6KBHX has been recognized by numerous IC designers. For example, Realtek Semiconductor Corp. has been able to mount it, through the application of system-in-package (SiP) techniques, on the single-chip microcomputer of a RTL8715A Wi-Fi IP Cam system, thereby offering their clients the lowest power consumption of any IC worldwide without being required to modify existing equipment specifications. Therefore, the W948V6KBHX is the optimal solution for low-power IP camera systems.

In addition to exclusive previous description, W948V6 complies all JEDEC LPDDR specification, including package type (VFBGA60), voltage supply (1.8v), IO width (x16) and operating frequency (166/200MHz). It could work from -40 to 85 °C. At the room temperature of 25 °C, Self-refresh current will be lower down to 25 uA(when chip is only used in 1/16 array).

Winbond has successfully incorporated DSR technology into numerous products. Always striving for innovation, Winbond will continue to release ultra-low-power mobile memory solutions of various capacities to meet the diverse needs of its clients. For more information on related products, please visit Winbond’s official website, or attend the Winbond forum at the 2018 electronica conference.



About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory with Winbond’s memory business revenues in 2017 about US$1.25 billion. Winbond has approximately 2,800 employees worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and the USA. For more information, please visit: www.winbond.com.



Product Contact
Sierra Lai
Deputy Director of Mobile DRAM Memory Product Marketing
TEL: +886-3-5678168 Ext. 75373
E-mail: WCLai@winbond.com
Technical Contact
Hsin-Min Lin
DRAM Product Marketing Manager
TEL: +886-3-5678168 Ext. 75328
E-mail: HMLin7@winbond.com
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TEL: +886-3-5678168/+886-987-365682

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