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  • Winbond Launches Low Power Mobile Memory in 2007 Hongzhou eif

    Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

  • Winbond Electronics Presents Low Power Mobile Memory

    Winbond is attending the 2008 IIC-China Shenzhen (Mar./3-4 Shenzhen Convention and Exhibition Center) & Shanghai (Mar./10-11 Shanghai Mart). We are glad to introduce Winbond's two new families of Mobile Memory components for mobile applications, Low Power DRAM and PSRAM that meet the increasing need...

  • Winbond is attending the Taitronics 2008. We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM.

    Winbond is attending the Taitronics 2008 (Oct. 7-11, Taipei World Trade Center Nangang Exhibition Hall, Booth: 4F M102). We are glad to introduce Winbond’s two new families of Mobile Memory components for mobile applications, Mobile DRAM and PSRAM that meet the increasing need of low power consumpti...

  • Winbond to Exhibit Mobile RAM Solution

    Winbond Electronics Corporation, a leading supplier of semiconductor solutions, announced that during its annual product event, the Company will exhibit its suite of RAM IC solutions aimed at mobile handheld devices. Addressing the needs of personal wireless communication products, such as cell phon...

  • Winbond to reveal a new-generation Ultra-Low-Power Mobile DRAM solution at the 2018 electronica conference

    MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation is scheduled to present a new-generation ultra-low-power (ULP) DRAM at the 2018 electronica conference being held in Germany this November. The ultra-low power and high performance of this product make it particularly suitable for...

  • Winbond Electronics Launches a Series of Mobile Memory Products - LPDDR4X targeting at Niche Market

    (TAICHUNG CITY, Taiwan –12 September, 2019)-With the driving force of new technologies such as artificial intelligence (AI), ultra-high-resolution display, 5G mobile communication, and IoT, various kinds of new applications are emerging. Advanced Driver-Assistance Systems (ADAS), Smart Speakers, 8K ...

  • Mobile DRAM

    Winbond Electronics Corporation is a leading supplier of semiconductor solutions to the consumer, computer, communications, and electronics product markets. Winbond developed the mobile DRAM devices with a low IDD current value, which helps Winbond to extend mobile DRAM memory applications beyond th...

  • Winbond Electronics Corporation Licenses Mobile-FCRAM from Fujitsu

    (Hsin-Chu, Taiwan)Winbond Electronics Corporation today announced a ground breaking licensing agreement with Fujitsu Limited for developing Fast Cycle Random Access Memory (FCRAM)technology. The agreement involves Fujitsu licensing its proprietary 32M Mobile-FCRAM to Winbond. In return, Winbond, the...

  • Winbond releases Pseudo SRAM(W96 Series)

    At this year's eMEX 2006, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Frequ...

  • Winbond releases 256Mb LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at 2007 IIC-China

    Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...

  • Winbond Electronics Releases Largest Capacity Pseudo SRAM on the Market

    At this year's IIC 2007, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Freque...

  • Winbond Electronics Unveils 256MB LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

  • Winbond Electronics Releases Largest Capacity CellularRAM on the Market

    SemiTech Taipei 2007, May, 10~12, 2007- With the emergence of a new generation of handheld devices, Winbond Electronics Corp. brings 256 Mb Pseudo SRAM to the market. Focusing on niche memory IDM, Winbond launches largest available 256 Mb CellularRAM standard PSRAM; this density is the best choice f...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007

    Date : Sep/5/2007-Sep/8/2007 Location : Hangzhou Peace International Exhibition & Conference Center Booth : H13-23, G14-24 Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufactur...

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