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  • Winbond Electronics has come up with a new low-density DDR3 SDRAM to fulfill the demand of new applications

    Nowadays, info-electronic devices are evolving towards the trend of thinner, lighter and less power consumption. In order to remain high performance, the memories used in these devices are required to have features such as high-speed, low-power consumption and down-sizing. Fully understanding market...

  • Winbond introduces new class of high-quality NAND Flash to provide lower cost alternative to NOR Flash for code storage in mission-critical applications

    High Quality NAND Flash from Winbond to give automotive system manufacturers new pathway to higher-density code memory as NOR Flash scaling reaches its limit NUREMBERG, Germany and TAICHUNG, Taiwan – 27 February, 2018 -- Winbond Electronics Corporation, a leading global supplier of semiconductor mem...

  • Winbond’s new OctalNAND Flash provides fast, low-cost alternative to Octal NOR Flash in densities of 1Gbit and higher

    New W35N-JW NAND products featuring Winbond’s OctalNAND Flash offer robust and reliable code storage in automotive and industrial applications (Taichung, TAIWAN – 17 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the i...

  • The keys to successful adoption of new low-voltage memory ICs

    Today, the circuitry on the board in mainstream industrial and consumer products operates from a wide range of supply voltages: the power rails are most commonly at 5V, 3V, 2.5V, 1.8V and various lower voltages. To ensure compatibility between devices from different manufacturers, and to avoid unnec...

  • New lower-cost memory solution for 5G cellular modems helps drive adoption of ultra-fast wireless broadband

    5G is a technology platform which supports many potential use cases and end product types, from super-fast mobile broadband for next-generation smartphones, to mission-critical and emergency service communications networks, to dense arrays of low-power, always-on wireless sensors for innovative Inte...

  • Winbond releases Pseudo SRAM(W96 Series)

    At this year's eMEX 2006, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Frequ...

  • Winbond releases 256Mb LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components designed to meet the needs of mobile devices. Shown at eMEX 2006 this year is the W988D6E / W988D2E 256MB Low Power DRAM. Its key features are: W98 Series LPSDR SDRAM (Single Data Rate Synchronous DRAM) Conforms to the JEDEC standard 2...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at 2007 IIC-China

    Winbond 2007 IIC-China Shenzhen March 5-6 th , Shenzhen Convention and Exhibition Center Booth No.:2C25 Shanghai March 13-14 th, Shanghai Mart Booth No.:4C07 Winbond will attend the upcoming International IC China (IIC-China) Exhibition hosted by Global Sources. Multiple Winbond IC designs as well a...

  • Winbond Electronics Releases Largest Capacity Pseudo SRAM on the Market

    At this year's IIC 2007, Winbond Electronics launched the Pseudo SRAM with the largest density in the market. The W968D6B has the following key features: W96 Series Pseudo SRAM Conforms to CellularRAM 1.5G standard Density: 256Mb (16M x 16) Low operating voltage and input/output voltage: 1.8V Freque...

  • Winbond Electronics Unveils 256MB LowPower DRAM

    Winbond has launched a range of Low Power DRAM memory components for mobile devices. The W988D6E / W988D2E 256 MB Low Power DRAM will be shown at IIC 2007. LP SDR/DDR will become Mainstream In recent years there has been an upsurge in sales of replacement mobile phones. The driving force behind this...

  • Winbond Introduces products for broad range applications: 64Mb, 128Mb, and 256Mb SDRAM

    Winbond is introducing new SDRAM products for broad range applications, including: 64Mb (W9864 series), 128Mb (W9812 series), and 256Mb (W9825 series). These products will be on exhibition at the 2007 Taipei Semiconductor Industry Exhibition, and have passed SGS inspection, JGPSSI standards. The SDR...

  • Winbond Electronics Releases Largest Capacity CellularRAM on the Market

    SemiTech Taipei 2007, May, 10~12, 2007- With the emergence of a new generation of handheld devices, Winbond Electronics Corp. brings 256 Mb Pseudo SRAM to the market. Focusing on niche memory IDM, Winbond launches largest available 256 Mb CellularRAM standard PSRAM; this density is the best choice f...

  • Winbond Introduces Industry's First QUAD-SPI Serial Flash Memory

    • W25Q16 SpiFlash Memory Offers Single, Dual, Quad I/Os in Space-Saving 8-Pin Package • 320Mhz-Equivalent Clock Rate Gives More than 6X Performance Boost • Cost-Effective, Code-Execution Alternative to Parallel NOR Flash SAN JOSE, Calif. – Aug 7, 2007 -- Winbond Electronics Corporation announced tod...

  • Winbond Launches Low Power Mobile Memory in 2007 Hongzhou eif

    Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA), Hangzhou Municipal Government and Trade Development Bureau of Ministry of Commerce during Sep.5 t...

  • Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007

    Date : Sep/5/2007-Sep/8/2007 Location : Hangzhou Peace International Exhibition & Conference Center Booth : H13-23, G14-24 Winbond Electronics Corp. will attend the upcoming Electronics & Information Fair, Hangzhou, China 2007(eif) Exhibition hosted by the Taiwan Electrical and Electronic Manufactur...

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