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相容于业界通用标准的<span class="match">SLC</span> NAND Flash 华邦提供了一系列从1Gb到8Gb且相容于业界标准的<span class="match">SLC</span> NAND。在软、硬体控制与介面上，都跟市面上所有的<span class="match">SLC</span> NAND一样。因此，使用者可以很轻易地在华邦这个产品系列中，找到自己合适的产品来替换使用。 点击并搜寻产品相关规格 具有竞争力优势及产品应用 华邦的<span class="match">SLC</span> NAND可以被使用在任何支援NAND介面的平台上，也能让客户根据主控晶片上对ECC的要求来选择相对应1-bit ECC或4-bit ECC的<span class="match">SLC</span> NAND，拥有更多更弹性的选择。华邦的<span class="match">SLC</span> NAND被广泛的使用在IoT、车用、网路通讯、储存、机上盒、DSL、数位电视、手机、...

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https://www.winbond.com/productResource-files/Winbond%20SLC%20NAND%20Flash%20Product%20Brief.pdf

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闪存包含NOR、NAND和支援安全加密的TrustME® 系列闪存。华邦电子是全球最大的Serial Flash供应商，在SpiFlash® 产品系列，容量从512Kb到1Gb，电压支援1.8V与3V，提供8-pin、16-pin SOIC和24-ball BGA的封装，并可达到133MHz的操作频率。 <span class="match">SLC</span> NAND Parallel flash容量由1Gb到4Gb，符合JEDEC标准封装与ONFi规范。QspiNAND是既有SpiNOR的延伸产品，提供1Gb到2Gb的容量，并在读取效率上新增连续性的特殊读取功能，可以增加系统在DRAM和Flash间的读取效率。QspiNAND包含了内建的...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/index.html?__locale=zh

多芯片封装(MCP)系列产品是将1.8V的NAND记忆体和1.8V的低功耗DRAM合封于同一个封装中。两颗芯片合封在同一个封装中的好处是能够节省电路板的面积，进而降低整个系统的成本。在很多非常在意系统空间的应用中，例如手机和一些可携式装置，这种能让电路板面积缩小的多芯片封装，就显得更有优势。 点击并搜寻产品相关规格 自有DRAM和<span class="match">SLC</span> NAND记忆体生产、制造技术 华邦是一间拥有DRAM和Flash独力设计、生产并销售的公司。换言之，从产品设计，生产制造到市场销售都是自有品牌并无假手他人的公司，因此能向全世界稳定提供最好最优质的中低容量记忆体产品。 自有12吋晶圆厂 华邦用自有的12吋厂来专...

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1Gb NAND + 1Gb LPDDR2 产品特点 W29N01GZ NAND Flash Memory Basic Features Density : 1Gbit (Single chip solution) Vcc : 1.7V to 1.95V Bus width : X8 Operating temperature Industrial: -40°C to 85°C Single-Level Cell (<span class="match">SLC</span>) technology. Organization Density: 1G-bit/128M-byte Page size:2,112 bytes (2048 + 64 b...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW10GF3FW.html?__locale=zh

1Gb NAND + 1Gb LPDDR2 产品特点 W29N01GW NAND Flash Memory Basic Features Density : 1Gbit (Single chip solution) Vcc : 1.7V to 1.95V Bus width : x16 Operating temperature Industrial: - 40°C to 85°C Single-Level Cell (<span class="match">SLC</span>) technology. Organization Density: 1G-bit/128M-byte Page size:1,056 words(1024 +32 w...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW11GF1EW.html?__locale=zh

1Gb NAND + 512Mb LPDDR1 产品特点 W29N01HW NAND Flash Memory Basic Features Density : 1Gbit (Single chip solution) Vcc : 1.7V to 1.95V Bus width : x16 Operating temperature Industrial: -40°C to 85°C Single-Level Cell (<span class="match">SLC</span>) technology. Organization Density: 1G-bit/128M-byte Page size 2,112 bytes (2048 + 6...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW11HC1DW.html?__locale=zh

2Gb NAND + 1Gb LPDDR2 产品特点 W29N02GZ NAND Flash Memory Basic Features Density : 2Gbit (Single chip solution) Vcc : 1.7V to 1.95V Bus width : x8 Operating temperature Industrial: -40°C to 85°C Single-Level Cell (<span class="match">SLC</span>) technology. Organization Density: 2G-bit/256M-byte Page size 2,112 bytes (2048 + 64 b...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/item/W71NW20GF3FW.html?__locale=zh