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QspiNAND FlashCode Storage Flash Memory / QspiNAND Flash
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How to use Status Registers of Winbond SPI NOR Flash
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000051.html&level=3
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AN0000040 How to work with Winbond Serial NAND Flash build-in ECC V1.0
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000040.html&level=1
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W25N04KWxxxU Verilog Model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA02-DBG075_3.html&level=2
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W25N04KW_Datasheet
Datasheet
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA00-W25N04KW.html&level=1
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AN0000013 Migration Guide from SPI NOR to SPI NAND
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000013.html&level=2
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AN0000009 Serial Flash PCB Layout Guidelines
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000009.html&level=1
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W25N04KWZEIR IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-DBG075_2.html&level=3
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W25N04KWZEIU IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-DBG075_3.html&level=3
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W25N04KWZEJR IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-DBG075_6.html&level=3
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W25N04KWZEJU IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-DBG075_7.html&level=3
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AN0000014 SpiStack® Quad SPI Operations using the NXP LS1012ARDB Board
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000014.html&level=4
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AN0000060 W35N FMEA v1.0
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000060.html&level=4
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AN0000034 SpiFlash W25 Q vs M option v1.1
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000034.html&level=2
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AN0000062 Read disturb consideration in 46nm AG NAND
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000062.html&level=1
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AN0000033 Layout Compatibility Standard WSON8 vs WFLGA8 5x6mm Packages
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000033.html&level=2