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Higher Manufacturing Throughput and Faster OTA with Winbond QspiNAND and SpiStack® Flash

Winbond will introduce how faster erase and program capabilities of Winbond’s QspiNAND and SpiStack® Flash can improve not only manufacturing throughput, thus lowering costs, but also provide better performance to address the growing popularity of OTA where typically a large amount of code or data is remotely updated...

Presenter:

Jackson Huang / Winbond Electronics Corporation America

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在线研讨会

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