Winbond Joins AI Expo 2024 - AIvolution

[Event Information]

Winbond Electronics Coporation will participate in AI Expo 2024, organized by Digitimes. Winbond will share our products and technologies, as well as how we help our customers on the development and widespread of AI applications.

[Product Information]

• GP-Boost Series DRAM: From HYPERRAM to LPDDR4/4X, Winbond provides low-capacity and high-bandwidth memory solutions in AI applications. For more information about GP-Boost DRAM, please refer to our video.
• CUBE: Using 3D stacking technilogy and heterogeneous bonding technology to provide high-bandwidth and low-power single 256Mb to 8Gb memory, designed to meet the growing demand for edge AI computing devices. For more information about CUBE, please refer to our latest press release.

[Speech Information]

Leo Cheng, Winbond's sales assistant manager, will also deliver a speech titled "AI and Memory: Exploring How Artificial Intelligence Drives Innovation and Development in Memory Technology" on April 24 at 1:50 PM. This session will share:

• How to meet these demands via new architectures, processes and techlogical innovations.
• The impact of AI on memory hardware performance and energy efficiency
• How to optimize the design and development of memory in the AI era.
• Finally, we will look into the future and discuss how the interaction between AI and memory technology drive industry development.

In addition, there will be activities at the Winbond booth and everyone will have chance to get the gifts. Welcome to join us at Winbond booth !

About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME^® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Event contact
Sophia Hsu
Digital Marketing Adminstrator
TEL: 886-3-5678168 Ext.78515
E-mail: YTHsu2@winbond.com