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Winbond and Mobiveil Collaborate on Ultra-Low Power Applications
News
Winbond HYPERRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Mobiveil’s HYPERRAM Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based HYPERRAM x8/x16 - 250 MHz Memory TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a le...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=en