-
W25Q32JWSSIM IBIS Model
IBIS Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA03-AAG064.html&level=3
-
Winbond 1.2V Serial NOR Flash Product Brief
Code Storage Flash Memory1.2V Serial NOR FlashProduct Brief
https://www.winbond.com/productResource-files/Winbond%201.2V%20Serial%20Flash%20Product%20Brief.pdf
-
Winbond SpiStack Flash Product Brief
Code Storage Flash MemorySpiStack® FlashProduct Brief
https://www.winbond.com/productResource-files/Winbond SpiStack Flash Product Brief_EN_2024Q3_v1.pdf
-
Winbond Automotive Flash Product Brief
Code Storage Flash MemorySerial NOR FlashQspiNAND FlashSLC NAND FlashAutomotiveProduct Brief
https://www.winbond.com/productResource-files/Winbond Automotive Flash Product Brief_EN_2024Q3_v1.pdf
-
Others
Other
https://www.winbond.com/hq/hq/support/faq/technical/.content/faq/faq00004.html?__locale=zh
-
如何透过堆栈芯片的技术解决闪存容量不足、减少芯片脚位数,以及降低系统设计的复杂度
Technical Article
消费者对于产品的要求已经不满足于现状,在行动运算装置上,不断追求功能更多且更轻薄的产品。从前需要在笔电上作业的工作,现在早已经可以在智能型手机上完成。更不用说现在的智能型手表还能透过跟智能型手机连结而做到以前想象不到的事情。 在许多非常在意微小化电路空间的设计中,随着数据量的增加,储存器占用的空间对于微型化设计来说非常的关键。闪存的NOR通常用来储存开机程序,而NAND通常用来储存大量数据。在电路板设计时,都必须为这些闪存IC预留焊接空间。 串行式NOR和NAND闪存因为脚位少,更有利于微小型系统的设计。而华邦电子所生产的串行式NOR和NAND闪存约占全世界出货量的30%,在串行式闪存的出货量...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-improved-die-stacking-technology-reduces-pin-count-board-footprint-system-complexity.html?__locale=zh
首頁>
搜尋
搜尋
关键字搜索结果 “ 8pin ”, 6 项结果