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AN0000050 Bad Block Management for QspiNAND and OctalNAND
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000050.html&level=1
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AN0000052 JEDEC ID for W25N QspiNAND and W35N OctalNAND
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000052.html&level=2
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AN0000063 Read Retry feature for QspiNAND v1.0
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000063.html&level=1
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AN0000057 Linear address stack die for W25N QspiNAND and W35N OctalNAND
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000057.html&level=2
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AN0000036 Copy-back operation flow for W25N QspiNAND and W35N OctalNAND
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000036.html&level=2
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AN0000044 How to Program QspiNAND Flash v1.1
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000044.html&level=4
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华邦推出 QspiNAND Flash 新功能提升 Qualcomm® 9205 平台应用竞争力
News
(加州普莱森顿及台湾台中讯,2020年6月16日) – 全球半导体储存解决方案领导厂商华邦电子,今日宣布推出拥有新功能的 <span class="match">QspiNAND</span> Flash,是专为 Qualcomm® 9205 LTE 调制解调器而设计的。 华邦推出业界首创的 1.8V 512Mb (64MB) <span class="match">QspiNAND</span> Flash,为新型行动网络 NB-IoT 模块的设计人员提供正确的储存容量。 WebFeet Research 总裁 Alan Niebel 表示:「到了2020年,物联网的规模将成长到500亿个连网装置,未来几年 Quad SPI-NAND 的采用率可能会增加4到5倍,华邦的 1.8V <span class="match">QspiNAND</span>...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-a-new-qspinand-flash-for-use-with-qualcomm-9205-lte-modem.html?__locale=zh
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基于优异的 Continuous Read,华邦电子推出更能弹性使用的Sequential Read
News
Sequential Read 让最新 <span class="match">QspiNAND</span> Flash 产品的读取速度达到每秒52MB,且使用者能自由应用自己偏好的 ECC编码及数据配置 (2020年6月2日台湾台中讯) – 全球半导体储存解决方案领导厂商华邦电子今日宣布在 <span class="match">QspiNAND</span> Flash 系列产品中推出更具弹性的全新高速读取功能 – Sequential Read,持续坚守其在闪存领域中不断追求创新的理念。 越来越多汽车及 IoT 装置制造商采用 SLC NAND Flash 做为其取代传统 NOR Flash 在512Mb或更高容量的低成本替代解决方案。 华邦先前已在 High Performance Qua...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-new-sequential-read-function-in-high-speed-qspinand-flash.html?__locale=zh
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华邦推出适用于可穿戴和低功耗物联网设备的全新1Gb 1.8V QspiNAND 闪存
News
(2024-08-07 台湾台中讯) – 全球半导体存储解决方案领导厂商华邦电子今日宣布,推出全新1.8V 1Gb <span class="match">QspiNAND</span> 闪存产品W25N01KW。该款产品旨在满足可穿戴和电池供电物联网设备日益增长的多样化需求,如低待机功耗、小尺寸封装及连续读取,以实现快速启动并支持即开即用。 W25N01KW闪存以其高速读取性能脱颖而出,在连续读取(Continuous Read)和顺序读取(Sequential Read)模式下的速度均高达 52MB/秒,而快速启动和即开即用特性不仅有助于提升能效,还延长了设备的使用寿命。此外,W25N01KW闪存提供深度省电(Deep Power Down)...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2024_0807_unveiled_1gb_qspinand_wearable_lowpower_IoT.html?__locale=zh
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W25N02KVxxxE Verilog Model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA02-DAG075_4.html&level=2
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超高写入速度的QspiNAND:汽车OTA升级新选择
Technical Article
近日,宝马集团宣布将对全球逾75万辆汽车进行OTA(Over-The-Air Technology)升级,将车内的宝马7.0操作系统升级到最新版本。升级内容涉及数字化服务、驾驶辅助、电气、底盘和动力系统等模块。如今,进行汽车远程OTA升级已不再是造车新势力们的“专利”。在传统汽车阵营,上汽通用也在和宝马一样进行OTA升级。由此可见,OTA升级正迅速发展成为未来智能汽车的必备功能。这主要有两个原因: 首先,随着汽车系统程序代码的指数级增长,汽车越来越多地成为网络攻击的目标。通过软件实现驾驶辅助功能的汽车,如果系统软件遭到黑客攻击或篡改,那么在自动驾驶模式下,驾驶员和乘客都将面临危险。通过OTA ...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/qspinand-ultra-fast-write-speed-for-over-the-air-on-automotive.html?__locale=zh
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W25N01JWxxxU Verilog Model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA02-UAG071_1.html&level=2
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W25N02JWxxxC Verilog Model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA02-UAG071_2.html&level=2
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W25N04KWxxxU Verilog Model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA02-DBG075_3.html&level=2
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W25N01JWxxIT Verilog Model
Verilog Model
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA02-UAG071_5.html&level=2
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