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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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AN0000015 HowToUseW74M
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000015.html&level=4
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AN0000001 Winbond Flash Device ID
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000001.html&level=2
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AN0000034 SpiFlash W25 Q vs M option v1.1
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000034.html&level=2
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AN0000033 Layout Compatibility Standard WSON8 vs WFLGA8 5x6mm Packages
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000033.html&level=2
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AN0000032 UV Process Specification for Flash KGD Wafer
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000032.html&level=2
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How to use Status Registers of Winbond SPI NOR Flash
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000051.html&level=3
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AN0000062 Read disturb consideration in 46nm AG NAND
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000062.html&level=1
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AN0000027 W29N04GX Datasheet Addendum Block Lock Features
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000027.html&level=4
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AN0000058 SpiFlash Wear Leveling Techniques v1.0
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000058.html&level=1
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AN0000067 Write Protection
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000067.html&level=1
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闪存 - 安全认证闪存
Authentication Flash
安全认证闪存提供了控制器和闪存之间的安全认证,以确保并增强这两个设备之间资料传输的安全性。 <span class="match">W74M</span>系列产品配有标准的HMAC-SHA-256加密引擎,以及4个独立的单向性闪存计数器,这些独立的计数器可提供各别的密钥进行HMAC签名。 系统透过各个独立的计数器,不仅可以验证计数器数值的完整性和真实性,还可以为传输的资讯添加时间戳印,更可以提高对重播攻击的抵抗力。 点击并搜寻产品相关规格 Block diagram of authentication flash <span class="match">W74M</span>产品不但能够让系统设计人员强化程序和资料存储的安全,也可以提供物联网周边设备连到云端的安全性,以及多层次的物联网设备的安全认证...
https://www.winbond.com/hq/hq/product/code-storage-flash-memory/authentication-flash/index.html?__locale=zh
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Winbond Authentication Flash Product Brief
Code Storage Flash MemoryAuthentication FlashProduct Brief
https://www.winbond.com/productResource-files/Winbond%20AuthenticationFlash%20Product%20Brief.pdf
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How to add multi-layered authentication into your IoTs?
Webinar
In today’s connected world, there’s no denying that smart devices need reliable security. If you’re looking for a cost-effective memory with authentication, you’ll find everything you need in Winbond’s <span class="match">W74M</span> memory devices. Built to offer comprehensive protection for IoT devices, these non-volatile m...
https://www.winbond.com/hq/hq/support/online-learning/webinars-item/webinars00001.html?__locale=zh
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华邦提供闪存芯片之安全认证功能
Technical Article
随着物联网的兴起,愈来愈多的新兴应用开始竞相崭露头角,例如:人工智慧、车联网、以及愈来愈聪明的日常用品。为了因应整个新兴产业链〈包含品牌厂商、代工厂商(ODM)、方案设计公司、甚至是终端产品和客户〉对安全性的要求,目前主要的主晶片〈包含SoC系统单晶片、微控制器、微处理器、ASIC特殊应用积体电路〉设计公司,多半已整合了硬体的加密引擎、乱数产生器 (RNG) 、以及安全〈但有限〉的记忆体存储空间在主晶片上。 尽管如此,多数的系统仍必须将开机程式码、韧体、作业系统、应用程式代码、各项参数设定或使用者资讯等资料存在外部的闪存中,而现有的闪存皆使用几乎兼容的指令、接脚和封装,使得所有存在闪存中的资料...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/closing-the-security-gap-left-by-conventional-nor-flash.html?__locale=zh
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Top Questions
Other
https://www.winbond.com/hq/hq/support/faq/technical/.content/faq/faq00007.html?__locale=zh