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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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HowToUseW74M
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000015.html&level=4
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AN0000001 Winbond Flash Device ID
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000001.html&level=2
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AN0000033 Layout Compatibility Standard WSON8 vs WFLGA8 5x6mm Packages
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000033.html&level=2
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AN0000032 UV Process Specification for Flash KGD Wafer
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000032.html&level=2
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AN0000034 SpiFlash W25 Q vs M option v1.1
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000034.html&level=2
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AN0000058 SpiFlash Wear Leveling Techniques v1.0
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000058.html&level=1
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AN0000027 W29N04GX Datasheet Addendum Block Lock Features
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000027.html&level=4
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How to use Status Registers of Winbond SPI NOR Flash
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000051.html&level=3
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AN0000062 Read disturb consideration in 46nm AG NAND
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000062.html&level=1
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AN0000067 Write Protection
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh&xmlPath=/support/resources/.content/item/DA01-AN0000067.html&level=1
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闪存 - 安全认证闪存
Authentication Flash
安全认证闪存提供了控制器和闪存之间的安全认证,以确保并增强这两个设备之间资料传输的安全性。 <span class="match">W74M</span>系列产品配有标准的HMAC-SHA-256加密引擎,以及4个独立的单向性闪存计数器,这些独立的计数器可提供各别的密钥进行HMAC签名。 系统透过各个独立的计数器,不仅可以验证计数器数值的完整性和真实性,还可以为传输的资讯添加时间戳印,更可以提高对重播攻击的抵抗力。 点击并搜寻产品相关规格 Block diagram of authentication flash <span class="match">W74M</span>产品不但能够让系统设计人员强化程序和资料存储的安全,也可以提供物联网周边设备连到云端的安全性,以及多层次的物联网设备的安全认证...
https://www.winbond.com/hq/hq/product/code-storage-flash-memory/authentication-flash/index.html?__locale=zh
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Winbond Authentication Flash Product Brief
Code Storage Flash MemoryAuthentication FlashProduct Brief
https://www.winbond.com/productResource-files/Winbond%20AuthenticationFlash%20Product%20Brief.pdf
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How to add multi-layered authentication into your IoTs?
Webinar
In today’s connected world, there’s no denying that smart devices need reliable security. If you’re looking for a cost-effective memory with authentication, you’ll find everything you need in Winbond’s <span class="match">W74M</span> memory devices. Built to offer comprehensive protection for IoT devices, these non-volatile m...
https://www.winbond.com/hq/hq/support/online-learning/webinars-item/webinars00001.html?__locale=zh
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华邦提供闪存芯片之安全认证功能
Technical Article
随着物联网的兴起,愈来愈多的新兴应用开始竞相崭露头角,例如:人工智慧、车联网、以及愈来愈聪明的日常用品。为了因应整个新兴产业链〈包含品牌厂商、代工厂商(ODM)、方案设计公司、甚至是终端产品和客户〉对安全性的要求,目前主要的主晶片〈包含SoC系统单晶片、微控制器、微处理器、ASIC特殊应用积体电路〉设计公司,多半已整合了硬体的加密引擎、乱数产生器 (RNG) 、以及安全〈但有限〉的记忆体存储空间在主晶片上。 尽管如此,多数的系统仍必须将开机程式码、韧体、作业系统、应用程式代码、各项参数设定或使用者资讯等资料存在外部的闪存中,而现有的闪存皆使用几乎兼容的指令、接脚和封装,使得所有存在闪存中的资料...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/closing-the-security-gap-left-by-conventional-nor-flash.html?__locale=zh
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闪存如何演进以符合工业4.0的设计需求
Technical Article
第四次工业革命 (也就是所谓的工业4.0) 是指大规模的将工业设备与作业生产流程作智能化整合。对于所有重要的电子器件和机器设备而言,都在工业4.0的范畴之内。 非挥发性内存也不例外,在工业4.0的发展趋势之下,非挥发性内存也面临5项重要的考验来满足设计的需求: 成本 芯片大小 速度 功耗 安全性 虽然有其它不同新兴的非挥发内存技术仍然正在发展,现今发展已久的闪存技术已被证实为最适合面临这些挑战。这篇文章将说明目前闪存的创新技术如何帮助系统研发人员利用新的设计已符合工业4.0的应用。 工业4.0的需求 全球著名的商业管理顾问公司麦肯锡对于工业4.0的定义 是对于工业制造的数字化, 并由以下4个项...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-serial-flash-is-evolving-to-meet-the-new-requirements-of-industry-4.0-designs.html?__locale=zh