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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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Authentication FlashCode Storage Flash Memory / Authentication Flash
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AN0000015 HowToUseW74M
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000015.html&level=4
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AN0000001 Winbond Flash Device ID
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000001.html&level=2
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AN0000034 SpiFlash W25 Q vs M option v1.1
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000034.html&level=2
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AN0000033 Layout Compatibility Standard WSON8 vs WFLGA8 5x6mm Packages
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000033.html&level=2
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AN0000032 UV Process Specification for Flash KGD Wafer
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000032.html&level=2
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How to use Status Registers of Winbond SPI NOR Flash
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000051.html&level=3
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AN0000062 Read disturb consideration in 46nm AG NAND
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000062.html&level=1
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AN0000027 W29N04GX Datasheet Addendum Block Lock Features
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000027.html&level=4
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AN0000058 SpiFlash Wear Leveling Techniques v1.0
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000058.html&level=1
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AN0000067 Write Protection
Application Note
https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=zh_TW&xmlPath=/support/resources/.content/item/DA01-AN0000067.html&level=1
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快閃記憶體 - 安全認証快閃記憶體
Authentication Flash
安全認證快閃記憶體提供了控制器和快閃記憶體之間的安全認證,以確保並增强這兩個設備之間資料傳輸的安全性。 <span class="match">W74M</span>系列產品配有標準的HMAC-SHA-256加密引擎,以及4個獨立的單向性快閃記憶體計數器,這些獨立的計數器可提供各別的密鑰進行HMAC簽名。 系統透過各個獨立的計數器,不僅可以驗證計數器數值的完整性和真實性,還可以為傳輸的資訊添加時間戳印,更可以提高對重播攻擊的抵抗力。 點擊並搜尋產品相關規格 Block diagram of authentication flash <span class="match">W74M</span>產品不但能夠讓系統設計人員強化程序和資料存儲的安全,也可以提供物聯網周邊設備連到雲端的安全性,以及多層次的物...
https://www.winbond.com/hq/hq/product/code-storage-flash-memory/authentication-flash/index.html?__locale=zh_TW
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Winbond Authentication Flash Product Brief
Code Storage Flash MemoryAuthentication FlashProduct Brief
https://www.winbond.com/productResource-files/Winbond%20AuthenticationFlash%20Product%20Brief.pdf
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How to add multi-layered authentication into your IoTs?
Webinar
In today’s connected world, there’s no denying that smart devices need reliable security. If you’re looking for a cost-effective memory with authentication, you’ll find everything you need in Winbond’s <span class="match">W74M</span> memory devices. Built to offer comprehensive protection for IoT devices, these non-volatile m...
https://www.winbond.com/hq/hq/support/online-learning/webinars-item/webinars00001.html?__locale=zh_TW
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華邦提供快閃記憶體晶片之安全認證功能
Technical Article
隨著物聯網的興起,愈來愈多的新興應用開始競相嶄露頭角,例如:人工智慧、車聯網、以及愈來愈聰明的日常用品。為了因應整個新興產業鏈〈包含品牌廠商、代工廠商(ODM)、方案設計公司、甚至是終端產品和客戶〉對安全性的要求,目前主要的主晶片〈包含SoC系統單晶片、微控制器、微處理器、ASIC特殊應用積體電路〉設計公司,多半已整合了硬體的加密引擎、亂數產生器 (RNG) 、以及安全〈但有限〉的記憶體存儲空間在主晶片上。 儘管如此,多數的系統仍必須將開機程式碼、韌體、作業系統、應用程式代碼、各項參數設定或使用者資訊等資料存在外部的快閃記憶體中,而現有的快閃記憶體皆使用幾乎兼容的指令、接腳和封裝,使得所有存在...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/closing-the-security-gap-left-by-conventional-nor-flash.html?__locale=zh_TW
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快閃記憶體如何演進以符合工業4.0的設計需求
Code Storage Flash MemoryTechnical Article
第四次工業革命 (也就是所謂的工業4.0) 是指大規模的將工業設備與作業生產流程作智慧化整合。對於所有重要的電子器件和機器設備而言,都在工業4.0的範疇之內。 非揮發性記憶體也不例外,在工業4.0的發展趨勢之下,非揮發性記憶體也面臨5項重要的考驗來滿足設計的需求: 成本 晶片大小 速度 功耗 安全性 雖然有其它不同新興的非揮發記憶體技術仍然正在發展,現今發展已久的快閃記憶體技術已被證實為最適合面臨這些挑戰。這篇文章將說明目前快閃記憶體的創新技術如何幫助系統研發人員利用新的設計已符合工業4.0的應用。 工業4.0的需求 全球著名的商業管理顧問公司麥肯錫對於工業4.0的定義 是對於工業製造的數位化...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-serial-flash-is-evolving-to-meet-the-new-requirements-of-industry-4.0-designs.html?__locale=zh_TW