The Path to Energy Efficiency and Carbon Reduction Innovation

As global attention to environmental protection and sustainable development increases, the demand for energy-saving, carbon-reducing, and low-carbon products is growing. With technological advancements and diverse application scenarios, various industries are increasingly seeking high-performance, low-power solutions. These demands primarily come from the following sectors:

• Smartphones and Mobile Devices: As smartphones become more powerful and muti-function, they require higher performance and lower power memory to support multitasking and prolonged the usage time. Low-power memory helps extend battery life and enhances user experience.
• Internet of Things (IoT) Devices: IoT devices are becoming more widely used in smart cities, smart homes, and Industry 4.0. These devices often need to operate for long periods on battery power, making low-power consumption essential.
• Automotive Electronics: The development of autonomous driving and electric vehicles requires high-performance, low-power memory to support real-time data processing and analysis, and to extend the EV car driving range.
• Industrial Automation: In industrial automation, low-power memory can improve equipment reliability and performance while reducing operational costs and energy consumption.
• Smart Home Devices: Smart home systems need low-power memory to maintain low power consumption during standby period and instant responsiveness, thereby enhancing overall energy efficiency.

Energy-efficient and carbon-reducing products do not necessarily need to be disruptive innovations. Insights can be gleaned from customer demands and the development of SOC/MCU, especially customer needs. Collecting more information to accurately reflect product specifications is key to sustained competitiveness.

Developing energy-efficient and carbon-reducing products is an ongoing effort, encompassing aspects such as product circuit design, process development, packaging forms, and material improvement, all contributing to energy savings and carbon reduction.

Winbond also foresees market trends for new-generation products, continuously investing resources in the pursuit of sustainable innovation in semiconductor design, production technology, and products. We provide customers with low-carbon emission and low-power green products, enhancing their competitive advantage and market share in green business opportunities. Winbond continually strives to improve its overall sustainable competitiveness.

HYPERRAM's Achievements in Energy Efficiency and Carbon Reduction

• HYPERRAM Applications: HYPERRAM is used in low-power IoT terminal products such as wearable devices, supporting functions like voice control and tinyML inference. It is also suitable for automotive dashboards, entertainment systems, industrial machine vision systems, HMI displays, and communication modules.
• HYPERRAM's Design Goals: From the outset, HYPERRAM was designed to replace traditional SDRAM in future IoT applications. Compared to SDRAM, HYPERRAM can reduce working power consumption by 70% and standby power consumption to just 5%, catering to the low power demands of emerging consumer trends in wearables and smart devices.
• Product Evolution: In 2022, HYPERRAM™ 3.0 mobile memory was launched, further reducing per-bit energy consumption by 40% while doubling the IO count. In 2023, the 1.2V WLCSP and 1.35V BGA49 packaged. The 1.2V HYPERRAM consumes 33% less power compared to the 1.8V HYPERRAM. HYPERRAM 3.1 products were introduced, becoming key low-power components for wearable devices. The 16-bit interface accelerates data transfer rates, providing a simplified, competitive, and long-lasting battery solution for low-power, smart processing, and HMI display fields.
• Packaging Advancements: Continuous advancements in small-sized packaging, from SDRAM's TSOP and BG60/54 to HYPERRAM's BGA24, 4x4 mm2  BGA49, and wafer-level packaging (WLCSP), have significantly reduced carbon emissions during production.
  

KGD (Known Good Die) Contributions to Carbon Reduction

Winbond has been deeply involved in the Known Good Die (KGD) field for many years, collaborating with chip manufacturers to provide System in Package (SiP) multi-chip packaging solutions. This packages solution plays a valuable role in net-zero and environmental sustainability issues, creating energy-saving and carbon-reducing end products focused on low-carbon and green products. Customers utilize Winbond's professional assistance to use KGD memory products in their SiP solutions. Memory chips and controller chips are stacked together and placed in a single package or module to provide SiP solutions. Other component’s KGDs can also be stacked with memory KGDs, saving packaging materials, enhancing performance, reducing power consumption, and saving chip area.

• Reducing Material Waste: KGD technology ensures that each die is a good die through testing and selection at the wafer level before packaging with the SoC, reducing material waste and the required circuit board area.
• Simplifying Assembly Processes: KGD technology simplifies assembly and packaging processes, further reducing energy use and carbon emissions during manufacturing.
• Reducing Energy Consumption: Due to shorter transmission paths, smaller parasitic capacitance, and lower I/O driving requirements, KGD technology reduces energy consumption.

Winbond CUBE's New Product Line Carbon Reduction Effects

High Performance, Low Power Design with Advanced Packaging: Extending the advantages of KGD, the CUBE product line combines advanced process technology with innovative low-power circuit designs. Through more advanced 2.5D or 3D packaging solutions, with reduced parasitic resistance and capacitance, memory products will achieve higher operational efficiency and lower energy consumption, becoming high-performance, low-latency, and low-power memory solutions.

• Power Efficiency: CUBE consumes less than 1pJ/bit, making it particularly well-suited for energy-sensitive applications.
• High Data Rates: CUBE provides total bandwidth ranging from 256GB/s to 1TB/s per die. This ensures accelerated performance that exceeds industry standards.
• Compact and Customizable Design: CUBE's 3D stacking options and compact size make it ideal for portable and space-constrained devices.
• Memory Densities: CUBE can be designed with densities ranging from 1-8Gb/die based on the D20 process, or 16Gb/die on the D16 process.

Process Technology Evolution and Carbon Reduction Benefits

• Process Technology Evolution: Continuous process shrinkage increases wafer yield, reducing the carbon footprint per die. Each complete process node can effectively reduce carbon emissions per die by 20-35%.
• Improved Manufacturing Processes: Winbond has optimized various process steps in DRAM manufacturing, including reducing process steps, increasing material utilization, and improving the energy efficiency of equipments. These measures collectively saves energy and reduce carbon in the production process.

CMS (Customized Memory Solution) Commitment to Energy Efficiency and Carbon Reduction

At CMS, our mission goes beyond manufacturing with renewable energy. We prioritize understanding customer needs, addressing system-level challenges, and continuously innovating to develop products that minimize energy consumption—making these efforts a core part of who we are.

CMS specializes in delivering memory solutions tailored to the unique demands of enterprises. Each solution is carefully designed and optimized for specific applications or environments, ensuring exceptional performance, reliability, and cost-efficiency.

Customized solutions focus on the following key areas:

• Memory Capacity and Speed: Designing memory modules with the appropriate capacity and speed to meet specific application demands.
• Memory Types: Providing a range of memory options, such as DDR4 and LPDDR4, to suit various requirements.
• Power Management: Optimizing energy efficiency to extend battery life and reduce overall power consumption.
• Reliability and Durability: Engineering memory solutions built for tough environments, including industrial, medical, and military applications, ensuring long-term performance and reliability.

These customized solutions are typically developed and delivered by professional memory suppliers or manufacturers, tailored to meet the specific needs of customers. This approach ensures optimal performance and seamless system compatibility.

CMS is committed to enhancing product value as a foundation for achieving stable sales and sustainable profitability. Looking ahead, CMS aims to launch high-value products that not only fulfill customer requirements for energy efficiency and carbon reduction but also contribute meaningfully to environmental protection and sustainable development. Together, we strive to create a cleaner, greener future.