Winbond HYPERRAM™ - Best DRAM Choice for AIoT Application

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The world is witnessing incredible growth in IoT, adding sensors and connectivity to all kinds of devices, including transportation, factories, wearable devices, and smart home applications. The data generated by these devices is also driving the need for increased processing to bring AI to the edge.  Combined, these factors are pushing designers to increase performance while reducing size and power consumption.

Winbond’s HYPERRAM is optimized for these applications and provides design simplicity, space saving, and low power operation while delivering the performance needed in these applications.