Winbond Electronics (Suzhou) Limited Opening Ceremony

  • Date:
    February 20, 2012
    Double Tree by Hilton Huaqiao / Kunshan 2F, A、B

Winbond Electronics (Suzhou) Limited Opening Ceremony had begun on Feb 20th, 10:00am at Hilton Huaqiao-Kunshan Hotel and successfully ended at 1:30pm.

The event was held by president Pei Ming Chen of Winbond Electronics (Suzhou) Limited. President Chen had addressed the roadmap of the Winbond Suzhou and our vision for the future.

Then addressed by Eddy Hung, who is vice President of DRAM Product Marketing Center and Monica Chao, Department Manager of Flash Memory Marketing Department, both of them had  introduced two major product lines of Winbond and made a brief introduction of current marketing status as well.

           Besides, we would like to express our heartfelt thanks to all those official’s attendance especially, such as Zhang Zhen Yue, theDeputy Director of Huaqiao Economic Development Zone、ICBC、Franklin Templeton investments、TEEMA and the Disty Representatives all over the China. It’s shown the pomp of this opening ceremony is great than ever.







Guest Arrival



Welcome Speech – Address by President Chen

President Pei Ming Chen


Winbond Roadmap & the Vision of the future

President Pei Ming Chen


Tea Break



DRAM Product Introduction

Assistant Vice President Wen Chang Hung


FLASH Product Introduction

Dept. Manager Yu Ping Chao


Tea Break



Address by Guests

Huaqiao Economic Development Zone  Secretary Deputy Director


Lunch Party



The photo of the Opening ceremony:




About Winbond

Winbond Electronics Corporation (TSE:2344) is the Memory IC company of excellence. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, manufacturing, and sales services.

Winbond owns three main business groups: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond’s product portfolio, consisting of Mobile RAM, Specialty DRAM, Graphics DRAM, and low/medium-density NOR Flash, is widely used by leaders in the consumer, communication, computer peripheral and automobile markets. Based on a 300 mm wafer fab, Winbond keeps pace with the latest technologies to provide high-quality memory IC manufacturing services.

Winbond headquarters in Central Taiwan Science Park, Taiwan, and also has subsidies in America, Japan, China and Hong Kong. For more information, please visit: https://www.winbond.com.

*Note: Winbond is a registered trademark of Winbond Electronics Corp. All other trademarks and copyrights mentioned herein are the property of their respective owners.


Event Contact
Jenny Chen
Sales Promotion Department
TEL: 886-3-5678168 #86333
E-mail: WCCHEN22@winbond.com

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