Winbond joins STMicroelectronics Partner Program to combine high-performance memory with STM32 devices in smart industrial and consumer applications

TAICHUNG, Taiwan—2023-03-08 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announces that it has joined the STMicroelectronics Partner Program to team Winbond's specialty memory ICs with ST's STM32 microcontrollers (MCUs) and microprocessors (MPUs).

The collaboration between the two companies moves to optimize integration and performance and assure long-term availability of both Winbond and ST devices to meet the needs of customers serving industrial markets.

“With Winbond and ST working together within the structure of the ST Partner Program, product developers can confidently integrate our memory with STM32 devices,” said Sierra Lai, DRAM Product Marketing Director, Winbond. “Our memories are the perfect choice for embedded projects, offering attributes such as small size, power-saving design, and low pin-count packages that simplify interconnection and save PCB cost.”

ST’s STM32 family is the market leader in MCUs and MPUs. It is built on industry-standard Arm® Cortex 32-bit cores and, across almost 20 series of devices, optimizes performance, energy efficiency, and advanced peripherals to serve the full spectrum of industrial, computing, and consumer applications. Moreover, its extensive STM32 ecosystem that comprises software, tools, and evaluation boards and kits, from ST and other ST Authorized Partners, simplify and accelerate development.

“The ST Partner Program is a high-value offering that has exceeded the expectations of our Customers and Partners helping customers’ design teams access strong supplemental skills, tools, and resources that meet design time-to-market challenges across the full ecosystem of products and services while easily integrating ST devices in their projects,” said Alessandro Maloberti, Partner Ecosystem Director, STMicroelectronics. “By selecting, qualifying, and certifying ST Authorized Partners, customers know that the partners they engage have the expertise to accelerate their design and development activities and ensure they ship the most robust and efficient products and services to market.”

Working with ST, Winbond is currently, focused on combining its DDR3 (double data-rate 3rd generation) dynamic RAM with ST's STM32MP1 series MPUs, which contain up to two Cortex-A7 cores and integrate features including advanced peripherals, IoT-security hardware and associated certifications, and high power-efficiency circuitry on-chip. Winbond's DDR3 supports the MPU's memory buffer to enhance performance in applications such as Industry 4.0, smart Homes, smart metering and HMIs that require both high performance and state-of-the-art security. Winbond has been delivering competitive DDR3 products for 10 years and will keep delivering DDR3 in coming 10+ years with superior customer support and product quality.

Becoming an ST authorized partner extends a collaborated that has already ensured Winbond's HYPERRAMTM provides ideal support for the memory buffer of ST's recently announced STM32U5 ultra-low-power MCUs based on the advanced Cortex-M33 core. HYPERRAM allows replacement of older interfaces like SDR and earlier DDR generations to realize whole-system power savings. It betters the performance of conventional PSRAM and permits a high-speed, low-cost, low pin-count, and super-low-power solution consistent with the ultra-low-power STM32U5.

Winbond’s extensive portfolio containing HYPERRAM, DDR3, LPDDR4/4X, DDR4 and other Mobile and Specialty DRAM is available through distributors and online. More information may be found at www.winbond.com.


About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.


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