(Taipei News) Winbond Electronics Corporation today announced the revenue results for the month of October, 2008. Revenue for the month was NT$ 1.698 billion, an increase approximately 1.26 percent when compared with NT$1.677 billion in the previous month. Accumulated revenue for January to October of 2008 was NT$ 19.749 billion.
Driven by efforts to shrink technology, October business saw an improvement from the previous month. With the impact of economic depression, customers are aggressively cutting their inventory levels and thus reduced demands of Specialty DRAM and Mobile RAM. Flash shipments, meanwhile, also declined month-over-month. Under pressure as recession looms, Winbond continues shrinking technology and driving cost reduction. As revenue of Memory IC manufacturing on 70nm technology continued to grow, October business demonstrated a positive growth.
The 65nm buried wordline technology will be introduced to 300mm wafer fab from November and ramp up in the second quarter of next year. Besides, NOR Flash will migrate to 90nm technology production during the first quarter of 2009. Winbond will also adjust production capacity to niche products with steady gross margins to further strengthen its competitive advantages.
Winbond Electronics Corp. Monthly Business Revenue Report (Unit: NT$ 1,000)
Monthly Revenue
| Accumulated Revenue | ||
---|---|---|---|
2008 October | 1,698,486 | 2008 Jan. ~ Oct. |
19,748,793 |
2008 September | 1,677,292 | 2007 Jan. ~ Oct. | 27,856,039 |
Increase (Decrease) |
1.26 % |
Increase (Decrease) |
(29.10)% |
Note1: The 2008 revenue is internal data and has not been audited by a CPA.
Note 2: Revenue dose not include Logic IC Business from July 2008.
Spokesperson
Wilson Wen
Executive Vice President of Memory IC Manufacturing Business Group
Tel:03-5792755
News Liaison
Mike Liu
Deputy Director
Tel:0966-233360
Email:ckliu@winbond.com