Winbond Injected USD 12.45 Million into Winbond Int’l Corporation

Taichung, Taiwan, July 30, 2010- Winbond Electronics Corporation (TSE: 2344), a worldwide leading supplier of specialty memory, today announced that it has made a capital injection of USD 12.45 million into Winbond Int’l Corporation (WIC). The purpose of the capital injection is to finance the general working capital of Winbond Electronics Corporation America (WECA). 

Located in San Jose, California, WECA is dedicated to IC design, marketing and product sales in Europe and the U.S. The main products include NOR Flash ICs and SDRAM ICs. WIC wholly owns the stocks of WECA and entrusts WECA with the product research and development.

    James Wen
    Vice President of Finance Center & CFO

News Liaison
    Ivy Hsu
    Professional Assistant Manager

Contact us

Copyright © Winbond All Rights Reserved.

This website uses cookies to ensure you get the best experience on our website. Learn more