Winbond Electronics Corporation Signed an NT$ 5 Billion Syndicated Loan Agreement with 10 Domestic Banks

Hsinchu, Taiwan, Nov. 19, 2012-Winbond Electronics Corporation today announced that it has signed an NT$ 5 billion three-year syndicated loan agreement. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Mr. James Chen, President of Chinatrust Commercial Bank at Sherwood Hotel Taipei. The main purpose of the syndication loan is to finance the term loan repayments and the working capital needs.


The syndication was led by Chinatrust Commercial Bank, Taishin International Bank, First Commercial Bank, DBS Bank and participated by six other financial institutions. The loan was oversubscribed and final facility amount was closed at NT$ 5 billion. The oversubscription represents banks’ recognition of Winbond’s credit standing and positive business prospects.


Winbond is a leading supplier of Specialty Memory with three major product lines including Specialty DRAM, Mobile RAM, and NOR Flash. We are able to deal with uncertainties of economic conditions and provide tier-1 customers with quality services through technology migration, balanced capacity mix of NOR Flash and DRAM products. In addition, mass production of 58nm and 46nm technologies will enhance cost competitiveness. With strong financial condition, Winbond will strive to deliver stable profitability and achieve  sustainable competitive advantages in the future.





Corporate Spokesperson

James  Wen

Finance Center  Vice President

TEL: 886-3-5678168




News Liaison

Mandy  Wang

Investor Relationship Dept.

TEL: 886-3-5678168 #81477



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