Winbond Sets Global Sustainability Standard with Sustainability Initiatives and Products

Industry Leading Sustainability Performance in 2021-2022 led to Numerous Awards and Recognition; Winbond on Track to Expand its ESG Leadership in 2023

TAICHUNG, Taiwan– 04-26-2023 Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the results of its sustainability performance along with aggressive goals and product development plans to expand that leadership in 2023. In addition to its many corporate Environmental Social and Governance (ESG) goals and initiatives, Winbond has also demonstrated its commitment to sustainability through its product development, including flash memory products that support low temperature soldering (LTS) process, space saving techniques used in 100BGA LPDDR4/4X, and advancements in ultra-low power consumption.

Below are just a few of Winbond’s sustainability achievements in 2021. To see the full results, go to this webpage.

“As one of the leading manufacturers of semiconductor memory products, Winbond is in a unique position to help drive carbon neutrality and slow global warming through its products, technologies and operations,” said Winbond. “Sustainability is an issue that needs to be tackled on a global scale and we are proud to set such a strong example driving a greener and more sustainable future.”


Goals and Objectives

Winbond is taking additional actions this year in the following areas to achieve specific goals by 2030 and 2050.


Products Designed with Sustainability in Mind

One of Winbond’s corporate goals is to always design products that support its sustainability efforts.   Below are a few examples:


2022 Awards and Recognition

As a result of its sustainability performance over the last year, Winbond received a number of industry awards and accolades.  This includes:

Certificates, quality, intellectual property patents and green products:

Won the ESG comprehensive evaluation award:

For more information about 2022 ESG Report, pls kindly visit the website.


About Winbond

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.


Chih-Chung Chou
Chief Financial Officer
TEL: +886-3-567-8168/+886-987-365-682

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