Winbond Releases Multiple Key Chips and IC Design Technologies at 2007 eMEX Suzhou

Date : Oct/18/2007~Oct/21/2007 
Location : Suzhou International Expo Center(Expo Plaza, Suzhou Industrial Park)
Booth : 4I28, 4B Hall


Winbond Electronics Corp. will attend the upcoming 2007 eMEX, Suzhou, China. Winbond together with WTC Walsin PSA (Passive System Alliance) Group* will join eMEX to demonstrate our complete range of products. Multiple Winbond IC designs as well as new products will be on display at the Suzhou International Expo Center. Winbond’s product lines include Mobile RAM, Computer Logic IC, Flash Memory, and μC and μC-Based Consumer IC. Details of the products on display are:

Mobile RAM for Mobile Phones
Computer Logic IC & Flash Memory for Information Electronics
μC and μC-Based Consumer IC for Consumer and Automobile Electronics 

More information about 2007 eMEX, visit: http://www.goemex.com/

*Note: Walsin PSA (Passive System Alliance) Group includes Walsin Technology, Hannstar Display, HannStar Board, Walton Advanced Engineering , tMt (Touch Micro-system Technology), Kamaya, Prosperity Dielectrics, POE International and Frontier Electronics etc..


News Contact:
Erin Chou
Sales Promotion Dept.

Contact us

Copyright © Winbond All Rights Reserved.

This website uses cookies to ensure you get the best experience on our website. Learn more