Winbond Injected USD 19.6 Million into Winbond Int’l Corporation

(Taipei News) Today, Winbond announces that the Board of Directors has approved a capital injection of USD 19.6 million of Winbond Int’l Corporation (WIC). The purpose of the capital injection is to finance the general working capital of Winbond Electronics Corporation America (WECA).

WECA is located in San Jose, California and is dedicated to IC design, marketing and product sales in Europe and the U.S. The main products include ISD speech IC and Serial Flash IC. WIC wholly owns the stocks of WECA and entrusts WECA with the product research and development.

Spokesperson
    Wilson Wen
    Vice President of Administrative Center
    Tel：03-5792755

News Liaison
    Mike Liu
    Deputy Director
    Tel：03-5792516
    Email：ckliu@winbond.com