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https://www.winbond.com/hq/support/documentation/downloadV2022.jsp?__locale=en&xmlPath=/support/resources/.content/item/DA01-AN0000023.html&level=4

Winbond’s HyperRAM™ product offers attractive combination of low pin count, low power consumption and high data bandwidth in miniature KGD form factor TAICHUNG, Taiwan – January 13, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced t...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/gowin-embeds-winbond-64mb-hyperram-for-ai-edge-computing.html?__locale=en

Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinix® Titanium Ti60 F100 <span class="match">FPGA</span> with the performance, low power consumption and small size needed for embedded AI applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/efinix-selects-winbond-hyperram-to-drive-a-new-generation-of-compact-ultra-low-power-ai-and-iot-devices.html?__locale=en

https://www.winbond.com/productResource-files/Winbond Automotive Flash Product Brief_EN_2024Q3_v1.pdf

In March 2016, Google’s AlphaGo made history when it won a Go match with a 4:1 advantage, against Lee Sedol, an honorary 9 dan player from South Korea. Go, which originated in China over 3,000 years ago is a highly complex game that requires multiple layers of strategic thinking. Then, Google’s Alph...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/choosing-the-right-flash-memory-for-ai-endpoint-applications.html?__locale=en

High bandwidth Octal interface 1.8V NOR Flash in densities from 64Mb to 2Gb Winbond W35T Octal NOR Flash family with the JEDEC xSPI interface offers a combination of high bandwidth, advanced features, and exceptional reliability. Winbond’s Octal NOR Flash delivers the highest synchronous byte-wide (...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/octal-nor-flash/index.html?__locale=en

Winbond is the first company to offer the new SpiStack® W25M Memory Series for “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and data storage, while providing designers with flash solutions most appropriate for their design requirements. SpiS...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/spistack-flash/index.html?__locale=en

3rd Generation HYPERRAM offers simplified design and double data-transfer rate for better performance in IoT devices TAICHUNG, Taiwan– 2022-04-14 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, together with Infineon Technologies, a world leader in sem...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-infineon-double-bandwidth-for-iot-applications-with-hyperram3.0.html?__locale=en

(Taichung, TAIWAN – 26 February, 2020) -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that the TrustME® W75F Secure Flash Memory has achieved PSA Certified™ Level 2 Ready in the PSA Certified independent security assurance scheme. Now...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-trustme-secure-flash-memory-achieves-psa-certified-level-2-ready.html?__locale=en

• W25Q16 SpiFlash Memory Offers Single, Dual, Quad I/Os in Space-Saving 8-Pin Package • 320Mhz-Equivalent Clock Rate Gives More than 6X Performance Boost • Cost-Effective, Code-Execution Alternative to Parallel NOR Flash SAN JOSE, Calif. – Aug 7, 2007 -- Winbond Electronics Corporation announced tod...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-introduces-industroal-first-quad-spi-serialflash.html?__locale=en

The potential for innovation created by artificial intelligence (AI) is exciting embedded developers in every market sector. In fact, it might seem strange to be thinking in terms of ‘innovation’, since the fundamental technology of AI is not itself new: IBM’s Deep Blue AI system beat chess world ch...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/why-embedded-developers-are-considering-serial-nand-in-ai.html?__locale=en

Winbond’s 4Gb LPDDR4X chip in 200B BGA package offers maximum 4267Mbps data rate at a clock rate up to 2133MHz TAICHUNG, Taiwan and Mountain View, CA– January 27, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, h...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/flex-logix-pairs-its-inferx-x1-ai-inference-with-winbond-4gb-low-power-ddr4x-in-edge-ai.html?__locale=en