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Winbond’s Multi-Chip Package (MCP) memory product family consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device in one package to provide the most space effective solution for saving area on PCBs (Printed Circuit Boards). One of the benefits of NAND flash is its non-...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/nand-based-mcp/index.html?__locale=en

TAICHUNG, Taiwan—2022-08-31 Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that they had received the ISO/SAE 21434 certification from TÜV NORD for Road vehicles Cybersecurity Management System (CSMS), making them the world’s first memor...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond_memory_vendor_ISO_SAE_21434_certification_road_vehicles_cybersecurity_management_System.html?__locale=en

TAICHUNG, Taiwan—2023-08-08 Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, is pleased to announce that their TrustME® W77Q Secure Flash family has received the prestigious ISO/SAE 21434 international standard certification. This certification is importa...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0808_iso_sae_21434_winbond_w77q_certification_memory_vendor.html?__locale=en

Semiconductor Applications in Intelligent and Autonomous Vehicals Japan announced that it will demonstrate its autonomous vehicle technology during the Tokyo Olympics as the specific demonstration of intelligent automobiles in recent years. Driven by The Fifth Generation Mobile Networks (5G) and Art...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/automotive-solution-on-low-power-dram.html?__locale=en

The potential for innovation created by artificial intelligence (AI) is exciting embedded developers in every market sector. In fact, it might seem strange to be thinking in terms of ‘innovation’, since the fundamental technology of AI is not itself new: IBM’s Deep Blue AI system beat chess world ch...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/why-embedded-developers-are-considering-serial-nand-in-ai.html?__locale=en

Mobile phones have become an integral part of our daily lives providing a compact platform for work and play. With newer software requiring faster computing, optimized RAM makes all the difference. Low power DDR SDRAM is a synchronous DRAM optimized for numerous IoT applications. What Is a Low-Power...

https://www.winbond.com/hq/hq/product/mobile-dram/low-power-ddr-sdram/index.html?__locale=en

Hsinchu, Taiwan, 03.07, 2017- Winbond Electronics Corporation (TSE:2344) , a worldwide leading supplier of specialty memory, announced it has signed a general quality agreement with Siemens, the world market leader in solutions for industrial market, for memory supply. It shows that the outstanding ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00431.html?__locale=en

https://www.winbond.com/hq/hq/about-winbond/company-profile/milestones/?__locale=en

W75F Secure Flash Solution is the first secure flash memory device to gain a Common Criteria (CC) EAL 5+ certificate. W75F enables secure eXecute-in-Place (XiP) and protects confidentiality and integrity of code / data in IoT devices. Application usage case include, but not limited to integrated UIC...

https://www.winbond.com/hq/hq/product/trustme/w75f-trustme-secure-memory-element/index.html?__locale=en

Automotive displays, both in the instrument cluster and in the Centre Information Display (CID), or head unit, are becoming larger, more sophisticated and more numerous. Thanks to the popularity of devices such as tablets and smartphones, car users have grown accustomed to interacting with technolog...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/a-better-high-density-storage-for-automotive-display.html?__locale=en

In March 2016, Google’s AlphaGo made history when it won a Go match with a 4:1 advantage, against Lee Sedol, an honorary 9 dan player from South Korea. Go, which originated in China over 3,000 years ago is a highly complex game that requires multiple layers of strategic thinking. Then, Google’s Alph...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/choosing-the-right-flash-memory-for-ai-endpoint-applications.html?__locale=en

In response to demand from security-conscious OEMs, the manufacturers of modern microcontrollers and systems-on-chip (SoCs) commonly equip their products with a broad range of security capabilities: standard, off-the-shelf 32-bit MCUs for mainstream, non-financial applications will today often featu...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/closing-the-security-gap-left-by-conventional-nor-flash.html?__locale=en

Industry’s vision for the Internet of Things (IoT) foresees the installation of billions of devices connected to the world’s universal network. All forecasts for the numbers of IoT nodes are huge. Simple mathematical reasoning suggests that the average production cost per node must be small, otherwi...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-efficient-memory-solutions-can-help-designers-of-iot-nodes-meet-tight-bom-cost-targets.html?__locale=en

The direction and force of consumer demand is relentless: buyers of mobile and computing devices are constantly looking for products that offer more features and better performance in a smaller, lighter, sleeker form factor. Applications that once would have required a laptop have migrated to the sm...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/how-improved-die-stacking-technology-reduces-pin-count-board-footprint-system-complexity.html?__locale=en