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Winbond and Mobiveil Collaborate on Ultra-Low Power Applications
News
Winbond HYPERRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh <span class="match">Mobiveil</span>’s HYPERRAM Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based HYPERRAM x8/x16 - 250 MHz Memory TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a le...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0830_winbond_mobiveil_collaborate_ultra-low_power_applications.html?__locale=en
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What You Need to Know about HyperRAM™ – An Alternative Memory Option
Technical Article
What is HyperRAM™? Before knowing HyperRAM™, one should understand HyperBus™ first. HyperBus™ technology was first unveiled by Cypress in 2014, and according to Cypress, “the HyperBus™ interface draws upon the legacy features of both parallel and serial interface memories, while enhancing system per...
https://www.winbond.com/hq/hq/support/online-learning/articles-item/what-you-need-to-know-about-hyperram.html?__locale=en
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Winbond moves into HyperRAM™ market to address new AIoT application needs
News
(HSINCHU, Taiwan –30 October, 2019) With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU supp...
https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-hyperram-can-address-new-aiot-application-needs.html?__locale=en
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Keyword search results for “ Mobiveil ”, 3 Matches