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https://www.winbond.com/productResource-files/Winbond%20High%20Performance%20QspiNAND%20Flash%20Product%20Brief.pdf

Semiconductor Applications in Intelligent and Autonomous Vehicals Japan announced that it will demonstrate its autonomous vehicle technology during the Tokyo Olympics as the specific demonstration of intelligent automobiles in recent years. Driven by The Fifth Generation Mobile Networks (5G) and Art...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/automotive-solution-on-low-power-dram.html?__locale=en

The new W25N is a single-level cell (SLC) QspiNAND Flash IC built using Winbond’s proprietary 46nm fabrication process. SLC NAND has higher reliability than the higher-density multi-level cell (MLC) and triple-level cell (TLC). Winbond's new High Performance QspiNAND flash memory enables a data tran...

https://www.winbond.com/hq/hq/product/code-storage-flash-memory/high-performance-qspinand-flash/index.html?__locale=en

Governments worldwide have been paying close attention to alternative energy vehicles recently. Many have launched related electric vehicle subsidy policies, accelerating global sales over recent years. In 2021 at IAA Mobility in Munich, Germany, many major car manufacturers, including Porsche, show...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/flash-memory-market-ushered-in-fierce-competition-with-the-digitalization-of-electric-vehicles.html?__locale=en

The Internet of things (IoT) is driving new capabilities that are transforming how we live, work and play. However, as our lives become more connected, the risk from hackers and other security breaches increases with every new IoT device. While most of us are pretty well versed in why we need to kee...

https://www.winbond.com/hq/hq/support/online-learning/articles-item/the-hidden-security-risks-of-automotive-electronics-system.html?__locale=en

Also at electronica exhibition, Winbond introduces new automotive-grade NOR Flash devices, and high-performance serial NAND Flash products in extended-temperature versions MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutio...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/winbond-announces-new-64mbit-addition-to-ultra-low-power-1.2V-spiflash.html?__locale=en