Also at electronica exhibition, Winbond introduces new automotive-grade NOR Flash devices, and high-performance serial NAND Flash products in extended-temperature versions
MUNICH, Germany – 13 November 2018 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFlash® memory products to a wider range of applications with the introduction of parts with new bigger memory capacities.
The W25Q64ND, offering capacity of 64Mbits, will be available for sampling early in 2019. The 128Mbit W25Q128ND is also in development, with customer samples expected by the end of 2019. Winbond already supplies the W25Q80ND 1.2V SpiFlash part in an 8Mbit density.
The 1.2V SpiFlash products offer typical Normal mode and Stand-by mode power savings of 33% compared to equivalent NOR Flash devices running from a 1.8V supply. Strong market demand has been led by manufacturers of wireless and battery-powered devices, in which the ultra-low power operation of the 1.2V SpiFlash memories complements other energy-saving technologies such as the Bluetooth® Low Energy short-range wireless networking protocol.
Winbond is introducing the extension of the 1.2V SpiFlash family at its stand B5.520 at the electronica exhibition (Munich, Germany, 13-16 November 2018), where it is also displaying new automotive grade NOR Flash products, and its extended-temperature range of high-performance Serial NAND Flash products.
Winbond is also announcing the implementation of a new 32nm process for manufacturing robust Single-Level Cell (SLC) NAND Flash products at its fabrication plant in Taichung City, Taiwan. The first 32nm part, now sampling to customers, is the W29N02KV, a 2Gbit ONFi NAND Flash device. The 32nm W25N02KV, a Serial NAND Flash part also in 2Gbit density, will be sampling to customers in the first half of 2019.
William Chen, Deputy Director of the Flash Product Marketing Division at Winbond, said: ‘Winbond is already a highly regarded, reliable supplier to high-volume manufacturing customers from its proven 46nm SLC NAND Flash process. Now the successful introduction to our fab of a new, high-yield 32nm process shows that Winbond continues to invest in advanced technology to meet the demanding cost and volume requirements of our customers.’
Addressing the automotive sector, the extended automotive grade product portfolio displayed by Winbond at electronica reinforces its position as a leading supplier to the market, backed by its long record of compliance with automotive quality and traceability standards.
The latest automotive grade parts to be announced by Winbond are the W25Q512JV in 512Mbit density and the 1Gbit W25Q01JV. The parts will be available in the first half of 2019 in temperature grades 3 (up to 85°C), 2 (up to 105°C) and 1 (up to 125°C). The new high-density parts are ideal for use in safety-critical applications that have a large code base, such as infrared cameras in Advanced Driver Assistance Systems (ADAS), and V2X communications systems.
At electronica, Winbond is also announcing the development of high-performance Serial NAND Flash parts in extended temperature versions up to AG2+ (115°C). The Winbond high-performance Serial NAND Flash products offer a unique combination of high-speed operation – Read speed up to 80MB/s – and robust operation in challenging automotive conditions. Automotive-grade Serial NAND Flash is available in densities up to 2Gbits.
About Winbond
Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory with Winbond’s memory business revenues in 2017 about US$1.25 billion. Winbond has approximately 2,800 employees worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and the USA. For more information, please visit: www.winbond.com.
Product Contact
William Chen
Deputy Director of Flash Memory Product Marketing
TEL: +886-3-5678168 Ext. 73891
E-mail: WLChen6@winbond.com
Technical Contact
Ken Lin
Deputy Director of Flash Memory Technical Marketing and Application Engineering
TEL: +886-3-5678168 Ext. 76510
E-mail: CCLin13@winbond.com
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Yulia Lee
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E-mail: ylli5@winbond.com
Spokesperson
Jessica Chiou-Jii Huang
Vice President & Chief Financial Officer
TEL: +886-3-5678168/+886-987-365682