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Hsinchu, Taiwan, 03.07, 2017- Winbond Electronics Corporation (TSE:2344) , a worldwide leading supplier of specialty memory, announced it has signed a general quality agreement with Siemens, the world market leader in solutions for <span class="match">industrial</span> market, for memory supply. It shows that the outstanding ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/news00431.html?__locale=en

(Hsinchu, Taiwan – June 22, 2015) Winbond introduced latest 2Gb DDR2 DRAM that not only meets <span class="match">industrial</span>/automotive temperature requirement operating from -40°C (LT) to 95°C (AG3)/105°C(AG2)/115°C (AG2 plus) but also fully complies with AEC-Q100 qualification standards (the Stress Test Qualification...

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TAICHUNG, Taiwan—2023-03-08 -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announces that it has joined the STMicroelectronics Partner Program to team Winbond's specialty memory ICs with ST's STM32 microcontrollers (MCUs) and microprocessors (MPUs). ...

https://www.winbond.com/hq/hq/about-winbond/news-and-events/news/2023_0308_winbond_stmicroelectronics_partner_combine_highperformance_memory_stm32_smart_industrial_consumer_applications.html?__locale=en

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